Radiation Detector Panel Assembly Thermal Management
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Solution Overview
Problem
The vertical stacking of tiles with direct conversion compound semiconductor layers, integrated circuits, and substrate layers in radiation detectors leads to heat-related noise and thermal variations, requiring effective heat management and high-voltage biasing while minimizing planarity issues and costs.
Innovation Solution
A radiation detector panel assembly structure where a bias plate conducts electricity and heat, with direct conversion compound semiconductor sensors attached directly to it, eliminating the need for a separate substrate and allowing for efficient thermal conductivity and high-voltage biasing, and the assembly is flipped for easy manufacturing and assembly with minimal height differences between tiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If vertical stacking of tiles with direct conversion compound semiconductor layer, IC layer and substrate layer is used, then the detector can convert photons into electric charges, but heat generated by IC couples to semiconductor detector and introduces unwanted noise and thermal variation
Solution Approach 1:
The detector structure is segmented into multiple functional layers: the compound semiconductor layer for photon detection, the IC layer for signal processing, and the substrate layer for mechanical support. This segmentation allows heat generated by the IC to be conducted away through dedicated thermal pathways in the substrate, preventing heat coupling to the sensitive semiconductor layer and reducing thermal noise.
Solution Approach 2:
The substrate layer acts as an intermediary between the IC layer and the compound semiconductor layer. It provides mechanical support while conducting heat away from the IC, serving as a thermal management intermediary that prevents harmful heat transfer to the detector element while maintaining structural integrity.
2Measurement precision
If vertical stacking of tiles is used to increase image size and resolution, then imaging performance is improved, but heat management becomes more difficult
Solution Approach 1:
The detector is divided into multiple independent tile modules that can be stacked or arranged in arrays. Each tile has its own substrate providing localized thermal management. This segmentation allows heat to be managed at the tile level, enabling scalable arrays that maintain effective heat dissipation even as the total detector area increases for higher resolution imaging.
Solution Approach 2:
The substrate layer performs multiple functions simultaneously: it provides mechanical support for the detector tile, serves as a thermal conduction pathway to dissipate heat from the IC, and offers a mounting surface for electrical connections. This multi-functionality enables effective heat management in scaled-up detector arrays without adding separate dedicated cooling components to each tile.
3Temperature
If direct conversion compound semiconductor sensor is attached to bias plate, then thermal conductivity is improved, but manufacturing complexity increases
Solution Approach 1:
The bias plate is merged with the substrate layer, combining the electrical biasing function and the thermal management function into a single integrated component. This reduces the number of separate parts that need to be assembled and eliminates the need for separate biasing electrodes, thereby simplifying manufacturing while maintaining effective thermal conduction from the IC to the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces thermal leakage, improves thermal conductivity, and lowers costs by eliminating the substrate, while ensuring reliable high-voltage biasing and minimizing planarity issues, enhancing the performance and reliability of radiation detectors.
Implementation Method 1
the direct conversion compound semiconductor sensor is configured to convert photons of the high energy electromagnetic radiation into an electric current
Implementation Method 2
the heat generated by the IC should be conducted away
Data Source
AI summary
According to an embodiment, a method comprises: configuring a panel plate as an entrance window for high energy electromagnetic, for example x-ray or gamma ray, radiation; attaching a bias plate on the panel plate, wherein the bias plate is configured to conduct electricity and pass the radiation through it; and attaching an array of tiles, where in each tiles comprises a direct conversion compound semiconductor sensor and a readout integrated circuit, IC, layer on the bias plate so that the direct conversion compound semiconductor sensor is configured on the bias plate; wherein the direct conversion compound semiconductor sensor is configured to convert photons of the high energy electromagnetic, for example x-ray or gamma ray, radiation into an electric current; and wherein the readout IC layer is situated next to the direct conversion compound semiconductor sensor and configured to receive the electric current and process the electric current. Other embodiments relate to a detector comprising an array of assemblies, and an imaging system comprising: an x-ray source and the detector.