Radiation Detector Connector in Substrate Opening
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Solution Overview
Problem
Existing radiation detectors face challenges in efficiently integrating connectors within the supporting substrate, which can affect the detector's electrical connectivity and thermal management.
Innovation Solution
The proposed detector structure includes a supporting substrate with an opening for a connector, which is electrically coupled to interconnect structures on a carrier board, allowing for efficient electrical connectivity and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connector is integrated within the supporting substrate, then the electrical connectivity is improved, but the manufacturing complexity increases
Solution Approach 1:
The connector is nested within the supporting substrate by forming it as an integrated component during substrate fabrication. The connector extends through the substrate thickness and makes contact with the carrier board, creating a compact nested structure that improves electrical connectivity while maintaining manufacturing efficiency through single-process integration.
Solution Approach 2:
The connector is positioned in the vertical dimension (through the substrate thickness) rather than only in the planar dimension. This three-dimensional positioning allows electrical connections to be established through the substrate depth, improving connectivity pathways without increasing lateral manufacturing complexity.
2Temperature
If the connector is located within the opening in the supporting substrate, then the thermal management is improved, but the device complexity increases
Solution Approach 1:
The connector structure merges multiple functions: it provides electrical connectivity between the carrier board and external circuits, while simultaneously serving as a thermal conduction pathway. The same conductive material and structural element that establishes electrical contact also conducts heat away from the detector, eliminating the need for separate thermal management components.
Solution Approach 2:
The connector within the substrate opening performs multiple functions: electrical connection, thermal conduction, and structural support. This multi-functional design improves thermal management without requiring additional dedicated components, thereby limiting the increase in overall device complexity.
3Reliability
If the connector is electrically coupled to interconnect structures on the carrier board, then the electrical connectivity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The connector is pre-formed as an integrated part of the supporting substrate during substrate fabrication, before the carrier board is attached. The connector's position, dimensions, and electrical pathways are established in advance with precise control, eliminating the need for post-assembly alignment and reducing manufacturing precision requirements during final assembly.
Data Source
AI summary
A detector structure includes a supporting substrate having an opening therethrough that is laterally surrounded on all sides by the supporting substrate, a carrier board located over a front side of the supporting substrate, the carrier board including interconnect structures electrically extending between the front side and a back side of the carrier board; at least one SIC located over the carrier board, the at least one ASIC including signal processing channel circuitry, at least one radiation sensor located over a front side of the at least one ASIC, and a connector located within the opening in the supporting substrate, the connector is electrically coupled to the interconnect structures on the back side of the carrier board. Further embodiments include detector modules including a plurality of above-described detector structures, a module circuit board coupled to the connectors by cables, and a heat sink.