Radiation Detector Assembly With Partitioned Thermal Control
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Solution Overview
Problem
Existing radiation detector assemblies in medical imaging devices, such as CT scanners, face temperature stability issues due to heat generation by components like ADCs, FPGA chips, and power supply chips, which affect the performance of photoelectric conversion devices.
Innovation Solution
Implementing a partitioned thermal control system with a main circuit board divided into regions for detector components and signal processing components, using a thermal control assembly and support assembly to manage temperature stability, and incorporating a layered thermal control mechanism with separate thermal coupling and insulation to reduce energy waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If active heating is used to maintain temperature stability of the photoelectric conversion device, then temperature stability is improved, but heat generated by circuit board components (ADC, FPGA chip, power supply chip) adversely affects the photoelectric conversion device
Solution Approach 1:
The circuit board is divided into a first region (mounting the detector component) and a second region (mounting the signal processing component). A thermal control assembly is thermally coupled to the first region, while a support assembly supporting the circuit board is thermally coupled to the second region. This spatial and thermal segmentation isolates the heat-generating signal processing components from the detector component, allowing independent temperature management of each region.
Solution Approach 2:
The support assembly acts as a thermal intermediary between the heat-generating signal processing component and the detector component. By being thermally coupled to the second region (signal processing component) but designed to minimize thermal coupling to the first region (detector component), it provides a thermal isolation path that allows the signal processing component to dissipate heat without adversely affecting the detector component's temperature stability.
2Stability of the object's composition
If thermal control is implemented for the entire circuit board, then temperature stability is improved, but energy consumption increases due to heating from signal processing components
Solution Approach 1:
The thermal control system is segmented into two independent parts: a thermal control assembly for the first region (detector component) and a support assembly for the second region (signal processing component). This allows the thermal control system to target only the detector component that requires temperature stability, rather than controlling the entire circuit board including heat-generating signal processing components, thereby reducing overall energy consumption.
Solution Approach 2:
Temperature control is applied locally only to the first region where the detector component is mounted, rather than uniformly across the entire circuit board. The thermal control assembly is specifically thermally coupled to the first region, providing localized temperature management that reduces energy waste by not attempting to control the temperature of heat-generating signal processing components in the second region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances temperature stability and reduces energy consumption by accurately controlling temperature, maintaining optimal conditions for photoelectric conversion devices, thereby improving imaging quality and efficiency.
Implementation Method 1
a thermal control assembly, thermally coupled to the first region of the main circuit board
Implementation Method 2
a support assembly, supporting the main circuit board and thermally coupled to the second region of the main circuit board
Data Source
AI summary
Embodiments of the present application provide a radiation detector assembly and a medical imaging device. The radiation detector assembly includes: a main circuit board, including a first region and a second region, wherein a detector component irradiated by rays is mounted in the first region, and a signal processing component that receives a signal generated by the detector component is mounted in the second region; a thermal control assembly, thermally coupled to the first region of the main circuit board; and a support assembly, supporting the main circuit board and thermally coupled to the second region of the main circuit board.


