Radiation Heat Dissipation Layer for Mobile Device Thermal Management
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Solution Overview
Problem
Mobile devices with thin designs face challenges in heat dissipation due to closed spaces, limiting the effectiveness of conventional heat dissipation elements like heat plates and vapor chambers, which struggle to efficiently dissipate heat generated by high-power calculation units.
Innovation Solution
A heat dissipation structure featuring a heat conduction main body with a radiation heat dissipation layer on one side, utilizing materials like copper and aluminum, and a nanostructure or porous ceramic radiation layer to enhance heat dissipation through natural convection and radiation, even in confined spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the mobile device is designed with thinner profile, then the portability and compactness are improved, but the heat dissipation capability deteriorates due to limited internal space and closed structure
Solution Approach 1:
The patent transitions from relying solely on convection (3D air flow) to incorporating radiation (electromagnetic wave propagation) as the heat dissipation mechanism. The radiation heat dissipation layer enables heat to be dissipated through electromagnetic radiation in all directions, effectively utilizing the dimensional space without requiring additional physical volume or opening the device structure.
Solution Approach 2:
The radiation heat dissipation layer is designed with a porous structure that increases the surface area for heat radiation. This porous configuration allows more heat dissipation sites within the limited thickness, enhancing the heat dissipation capability without increasing the device's external dimensions.
2Volume of stationary object
If conventional heat dissipation elements (heat plate, vapor chamber) are arranged in the narrow internal space, then some heat dissipation effect is achieved, but the heat conduction efficiency deteriorates due to ultrathin thickness requirements
Solution Approach 1:
The patent replaces the mechanical convection-based heat dissipation system (requiring air flow and physical space) with a radiation-based system. The radiation heat dissipation layer directly converts thermal energy to electromagnetic radiation, eliminating the need for complex mechanical convection structures and vapor chambers, thereby achieving effective heat dissipation in ultrathin configuration.
Solution Approach 2:
The heat dissipation structure employs composite material design, combining the heat conduction main body (for efficient heat transfer from heat source) with the radiation heat dissipation layer (for effective heat radiation). This composite structure optimizes both heat conduction and heat radiation performance within the constrained thickness.
3Reliability
If the internal space is kept closed to prevent alien articles and moisture entry, then the device protection is improved, but the heat dissipation performance deteriorates due to suppressed convection
Solution Approach 1:
The patent substitutes the convection-based heat dissipation mechanism (which requires open structure and air flow) with radiation-based heat dissipation. This substitution allows the device to maintain its closed protective structure while achieving effective heat dissipation through electromagnetic radiation that does not require physical openings or air exchange.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively enhances heat dissipation performance by leveraging radiation heat transfer, allowing for efficient heat exchange in closed spaces, preventing thermal accumulation and improving device efficiency.
Implementation Method 1
The heat dissipation structure is disposed in the closed space of the mobile device to provide a very good heat dissipation effect by way of natural convection and radiation
Implementation Method 2
utilizing the high thermal conductivity of materials like copper and aluminum
Implementation Method 3
The heat dissipation structure is disposed in the closed space of the mobile device to provide a very good heat dissipation effect by way of natural convection and radiation
Data Source
AI summary
A manufacturing method of heat dissipation structure applied to mobile device. The heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.