Radiation Heat Dissipation Layer for Thin Mobile Devices
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Solution Overview
Problem
Mobile devices with thin designs and closed spaces face challenges in heat dissipation due to limited convection and inefficient heat conduction, leading to heat accumulation and potential thermal crashes.
Innovation Solution
A heat dissipation structure featuring a heat conduction main body with a radiation heat dissipation layer on the heat dissipation side, utilizing materials like copper and aluminum with nanostructure or ceramic coatings for enhanced heat transfer through natural convection and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the mobile device is designed with thinned structure to improve portability, then the device becomes thinner and more convenient for carriage, but the internal space becomes narrow and closed, preventing effective heat dissipation through convection
Solution Approach 1:
The patent replaces the conventional convection-based heat dissipation system with a radiation-based heat dissipation system. By coating the inner surface of the housing with a high radiation heat dissipation material, the invention enables effective heat dissipation through thermal radiation without requiring air convection, thus solving the contradiction between thinned design and heat dissipation efficiency.
Solution Approach 2:
The patent changes the physical parameter of the housing surface by applying a radiation heat dissipation coating with high emissivity. This parameter change allows the housing to efficiently radiate heat at the given temperature, improving heat dissipation performance without increasing device thickness or creating convection pathways.
2Temperature
If passive heat dissipation elements like heat plate and vapor chamber are arranged inside the mobile device to improve heat conduction, then heat dissipation capability is enhanced, but the elements must be ultrathin to fit the narrow internal space, reducing their heat conduction efficiency
Solution Approach 1:
The patent extracts the heat dissipation function from the internal components and transfers it to the housing structure itself. By making the housing inner surface a high-radiation heat dissipation surface, the invention eliminates the need for separate heat dissipation elements like heat plates and vapor chambers, thereby simplifying the internal space arrangement while maintaining effective heat dissipation.
3Reliability
If the mobile device is formed with simple earphone port or connector port without other openings to prevent alien article and moisture entry, then device sealing is improved, but convection between internal air and ambient air is prevented, leading to heat accumulation
Solution Approach 1:
The patent replaces the convection-based heat dissipation mechanism (which would require openings) with a radiation-based mechanism. The high-emissivity coating on the housing inner surface enables heat dissipation through thermal radiation, allowing the device to maintain its sealed structure while effectively dissipating internal heat without requiring additional openings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat in closed spaces by leveraging radiation and convection, improving heat dissipation performance and preventing thermal issues in mobile devices.
Implementation Method 1
A radiation heat dissipation layer is formed on the heat dissipation side
Implementation Method 2
The heat conduction main body has a heat dissipation side and a heat absorption side
Implementation Method 3
provide a very good heat dissipation effect by way of natural convection and radiation
Data Source
AI summary
A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.