Radiation Imaging Sensor Panel Noise Shielding via Vertical Circuit Stacking

The patent transitions from horizontal isolation (2D plane separation) to vertical stacking (3D spatial arrangement). By arranging the analog circuit board, digital circuit board, and power supply circuit board in a vertical stack above the sensor panel, the design achieves noise isolation without increasing the horizontal footprint of the housing, thus resolving the contradiction between noise reduction and compact size.

The patent implements a nested arrangement where multiple circuit boards (analog, digital, power supply) are stacked vertically one above another, forming a compact tower structure above the sensor panel. This nesting approach maximizes spatial utilization and achieves effective noise isolation through layered positioning without expanding the overall housing dimensions.

The patent applies local quality by assigning specific functional roles to different vertical layers: the analog circuit board processes sensor signals immediately above the sensor panel, the digital circuit board handles digital processing above that, and the power supply circuit board provides power at the top. This functional stratification allows close proximity for signal integrity while maintaining noise isolation through the layered architecture.

By moving from horizontal to vertical arrangement, the patent achieves compact volume while maintaining adequate separation distances in the vertical dimension. The stacked configuration allows circuit boards to be physically close to the sensor panel for signal integrity while the vertical stacking itself provides natural noise isolation through spatial separation in the third dimension.