Radiation Imaging Sensor Bonding Under Reduced Pressure

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Solution Overview

Problem

The generation of bubbles in the bonding member between a scintillator and a sensor substrate during the manufacturing of radiation imaging apparatuses can lead to image degradation and unintended peeling or cracking of the scintillator, resulting in increased costs due to decreased yield and repair difficulties.

Innovation Solution

A manufacturing method involving bonding of the scintillator and sensor substrate under reduced pressure to suppress bubble formation, ensuring a stronger bond and preventing image quality degradation, which includes preparing a support substrate with the scintillator, bonding the sensor substrate and scintillator using a bonding member, and separating the support substrate while maintaining a reduced pressure environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If bonding is performed under atmospheric pressure, then the bonding process is simple, but bubbles are generated in the bonding member causing image degradation and bond weakness

Engineering Contradiction:

Improvebonding process simplicityVSAvoidbubble-free bonding quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies vacuum environment (inert atmosphere principle) during the bonding process to remove air and prevent bubble formation in the adhesive layer. By performing bonding under reduced pressure, air bubbles are eliminated from the bonding interface, ensuring high-quality bonding without compromising process simplicity

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent changes the pressure parameter during bonding - performing the bonding process under reduced pressure (vacuum) rather than atmospheric pressure. This parameter change effectively prevents bubble formation while maintaining bonding effectiveness, resolving the contradiction between simplicity and precision

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If bonding is performed under reduced pressure, then bubble formation is suppressed improving image quality, but the bonding process becomes more complex

Engineering Contradiction:

Improvebubble-free bonding qualityVSAvoidbonding process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent uses vacuum environment to suppress bubble formation during bonding. The inert environment principle is applied by removing air from the bonding zone, preventing air bubble entrapment in the adhesive layer, thus achieving high manufacturing precision

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent changes the pressure parameter to reduced pressure during bonding. This parameter modification effectively suppresses bubble formation and improves bonding quality, accepting increased process complexity as a necessary trade-off for achieving bubble-free bonding

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If bubbles are present in the bonding member, then the bonding process is easier, but the bonding force is weakened causing peeling or cracking

Engineering Contradiction:

Improvebonding process simplicityVSAvoidbonding force between scintillator and sensor substrate

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent applies vacuum environment during bonding to prevent bubble formation that would weaken the bond. By eliminating air bubbles from the adhesive layer, the bonding strength is maximized, preventing peeling and cracking of the scintillator during substrate separation

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent modifies the pressure parameter to reduced pressure during bonding. This change prevents bubble formation in the bonding member, ensuring strong bonding force between scintillator and sensor substrate, thus preventing strength-related failures

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively reduces bubble formation, enhancing the bonding force and image quality, and minimizing the risk of peeling or cracking, thus improving the yield and cost-effectiveness of the radiation imaging apparatus.

Implementation Method 1

bonding the sensor substrate and the scintillator via the bonding member

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

the bonding is performed under reduced pressure

Methodology Applied

Scientific EffectVacuum: Vacuum

Data Source

PatentUS20240053494A1Manufacturing method of radiation imaging apparatus, radiation imaging apparatus, and radiation imaging system

Publication Date: 2024.02.15 CANON KK

AI summary

A manufacturing method of a radiation imaging apparatus is provided. The radiation imaging apparatus includes a sensor substrate and a scintillator that are bonded by a bonding member. The manufacturing method includes: preparing a support substrate on which the scintillator has been formed; bonding the sensor substrate and the scintillator via the bonding member; and separating the support substrate after the bonding. The bonding is performed under reduced pressure.