Radiation Detection Panel Layout for Easier FPC Repair
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Solution Overview
Problem
The existing X-ray detection devices face challenges in workability during flexible circuit substrate repairs due to interference between heater members and support members, leading to increased noise in signal transmission due to longer circuit substrate lengths.
Innovation Solution
A radiation imaging device design where the base substrate's end portion is located further inward than the connection region, allowing for thermocompression bonding without heater interference and reducing circuit substrate length, thus facilitating repairs and minimizing signal noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the support member completely covers the back surface of the radiation detection panel, then the structural support is improved, but the heater member and support member interfere with each other during thermocompression bonding, making repair work difficult
Solution Approach 1:
The support member is segmented into a radiation detection panel support portion and a separate end portion that extends outward. This segmentation allows the heater member to access the radiation detection panel for thermocompression bonding without interference from the support member, enabling repair work while maintaining structural support functionality.
Solution Approach 2:
The support member's end portion extends in the horizontal direction (parallel to the radiation detection panel surface) rather than only providing vertical support. This dimensional extension allows the heater member to operate in the vertical direction without obstruction, resolving the interference issue while preserving support strength.
2Ease of manufacture
If the flexible circuit substrate is routed further outward than the end portion of the support member, then the connection to the electrode pad is achieved, but the flexible circuit substrate becomes longer and noise is easily added to transmitted signals
Solution Approach 1:
The support member is divided into a support portion that covers the radiation detection panel and an extended end portion that protrudes outward. This segmentation creates a dedicated routing path for the flexible circuit substrate along the extended end portion, allowing the substrate to reach the electrode pad without excessive length while maintaining connection capability.
Solution Approach 2:
The extended end portion of the support member acts as an intermediary structure that facilitates the routing of the flexible circuit substrate. It provides a controlled path that enables connection to the electrode pad while limiting the substrate length, thereby reducing noise in transmitted signals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables easier repair of the flexible circuit substrate without removing the radiation detection panel and reduces signal noise by shortening the circuit substrate length, improving workability and device efficiency.
Implementation Method 1
a process in which the adhesive member is thermocompression bonded by sandwiching the flexible circuit substrate, the adhesive member, and the X-ray detection panel between a pair of heater members and heating them
Data Source
AI summary
A radiation imaging device according to one embodiment includes a radiation detection panel having a first surface on which a detection region is formed and an electrode pad is formed outside the detection region, and a second surface on a side opposite to the first surface, a base substrate having a support surface configured to face the second surface of the radiation detection panel and configured to support the radiation detection panel, and a flexible circuit substrate connected to the electrode pad via a connecting member, wherein an end portion of the base substrate is located further inward than an inner end portion of the connection region in which the electrode pad, the connecting member, and the flexible circuit substrate overlap each other when seen in an Z direction orthogonal to the support surface.