Radiation-Sensitive Composition for Lithography
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Solution Overview
Problem
Current radiation-sensitive compositions for microfabrication in lithography face challenges in achieving superior nanoedge roughness and sensitivity, particularly in the context of miniaturization demands for semiconductor devices.
Innovation Solution
A pattern-forming method utilizing a radiation-sensitive composition comprising a complex formed from a transition metal compound with hydrolyzable groups and an organic compound, represented by a specific formula, which enhances solubility and nanoedge roughness properties when exposed and developed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional radiation-sensitive compositions are used, then basic lithography function is achieved, but superior nanoedge roughness and sensitivity cannot be obtained
Solution Approach 1:
The patent uses a composite material system consisting of a metal-containing component (transition metal compound with hydrolyzable groups) and an organic compound (carboxylic acid or derivative). This composite approach creates a radiation-sensitive composition that achieves both superior nanoedge roughness and high sensitivity, resolving the contradiction between manufacturing precision and reliability in lithography applications.
Solution Approach 2:
The patent modifies the chemical composition parameters of the radiation-sensitive material by introducing specific metal-containing components with hydrolyzable groups that react with carboxylic acids. This parameter change enables the formation of soluble complexes upon exposure, achieving both low nanoedge roughness and high sensitivity simultaneously.
2Length of moving object
If miniaturization is pursued in semiconductor processing, then device density increases, but achieving superior resist performance becomes more difficult
Solution Approach 1:
The patent changes the chemical parameters of the resist material by incorporating metal-containing components that form soluble complexes with carboxylic acids upon radiation exposure. This enables precise pattern formation at miniaturized feature sizes while maintaining superior resist performance including low nanoedge roughness.
Solution Approach 2:
The patent prepares the radiation-sensitive composition in advance with pre-selected metal-containing components and organic compounds that will react upon exposure. This preliminary preparation ensures that when miniaturization is implemented, the resist performance is already optimized for the required feature sizes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of patterns with improved nanoedge roughness and high sensitivity, suitable for future semiconductor device miniaturization processes.
Implementation Method 1
a metal-containing component that is a transition metal compound having a hydrolyzable group, a hydrolysis product of the transition metal compound having a hydrolyzable group, a hydrolytic condensation product of the transition metal compound having a hydrolyzable group
Implementation Method 2
a metal-containing component that is a transition metal compound having a hydrolyzable group, a hydrolysis product of the transition metal compound having a hydrolyzable group, a hydrolytic condensation product of the transition metal compound having a hydrolyzable group
Implementation Method 3
Radiation-sensitive compositions used for microfabrication by lithography generate acids in regions by irradiation with: far ultraviolet rays such as an ArF excimer laser beam and a KrF excimer laser beam; electromagnetic waves such as extreme ultraviolet ray (EUV); charged particle rays such as an electron beam; and the like, making a difference in a rate of dissolution in a developer solution between the light-exposed regions and light-unexposed regions, through a chemical reaction in which the acid acts as a catalyst
Data Source
AI summary
A pattern-forming method includes applying a radiation-sensitive composition comprising a complex on a substrate to provide a film on the substrate. The film is exposed. The film exposed is developed. The complex includes: a metal-containing component that is a transition metal compound having a hydrolyzable group, a hydrolysis product of the transition metal compound having a hydrolyzable group, a hydrolytic condensation product of the transition metal compound having a hydrolyzable group, or a combination thereof; and an organic compound represented by formula (1). In the formula (1), R1 represents an organic group having a valency of n, n being an integer of 1 to 4. In a case where n is 1, X represents —COOH. In a case where n is 2 to 4, X represents —OH, —COOH, —NCO, —NHRa, —COORA or —CO—C(RL)2—CO—RA.R1X)n (1)