Radiation-Sensitive Polymer for Wide Process Window Resist Patterns
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Solution Overview
Problem
In the production of fine resist patterns for electronic devices, existing radiation-sensitive compositions are prone to morphological problems and failures due to slight variations in process conditions, requiring a composition with a wide process window to prevent defects like bridge defects and collapses.
Innovation Solution
A radiation-sensitive composition containing a polymer with a specific structural unit that enhances sensitivity and allows for a wide range of process conditions, including a polymer with a structural unit represented by formula (1), which can generate sulfonate, imidic acid, or methide acid groups upon exposure, along with other components like acid generators and diffusion control agents to form a resist pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional radiation-sensitive compositions are used, then sensitivity is achieved, but the process window is narrow causing morphological problems under slight process variations
Solution Approach 1:
The patent modifies the chemical composition parameters of the radiation-sensitive material by incorporating specific polymer structures (formula 1) with controlled molecular weight and composition ratios. This changes the chemical reactivity parameters to achieve both high sensitivity and wide process window, resolving the contradiction between reliability and manufacturing precision.
Solution Approach 2:
The patent creates a composite radiation-sensitive composition by combining multiple components: the specific polymer (formula 1), acid generator, and other formulation additives. This composite approach allows optimization of individual component properties to achieve both high sensitivity and robustness against process variations, simultaneously improving reliability and manufacturing precision.
2Use of energy by moving object
If higher sensitivity is achieved, then exposure dose is reduced, but process window narrows making the composition more susceptible to defects
Solution Approach 1:
The patent optimizes the chemical parameters of the polymer structure (formula 1) including molecular weight, composition ratios, and functional group content. These parameter changes enable the composition to achieve high sensitivity (lower exposure dose) while maintaining a wide process window, thus resolving the contradiction between energy efficiency and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high sensitivity and a wide process window, enabling the formation of robust resist patterns with reduced defects even under varying process conditions, ensuring improved lithographic performance.
Implementation Method 1
a resin having repeating units which can generate an acid via decomposition through irradiation with active light or radiation
Implementation Method 2
a process target formed of a radiation-sensitive composition is irradiated with a far-UV ray (e.g., ArF excimer laser light), an extreme UV (EUV) ray, an electron beam, or the like, to thereby generate acid in a light-exposed part
Data Source
AI summary
A polymer containing a structural unit (I) represented by formula (1) is included in a radiation-sensitive composition. In formula (1), R2 is a single bond, a divalent hydrocarbon group, or the like. R3 is a divalent group represented by formula (2) or formula (3). R4 is a divalent organic group. Y− is a monovalent anion which can generate a sulfonic acid group, an imidic acid group, or a methide acid group through exposure to light. Ma+ is an a-valent cation. a is 1 or 2.