Radiation-sensitive resin composition, method of forming resist pattern, polymer, and compound
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Solution Overview
Problem
Existing radiation-sensitive resin compositions struggle to form resist patterns with superior water repellency and few defects, particularly in the context of miniaturized line widths of 40 nm or less, while maintaining favorable sensitivity to exposure light and performance in terms of LWR and CDU.
Innovation Solution
A radiation-sensitive resin composition comprising a first polymer with an acid-labile group, a second polymer with a specific structural unit, and a radiation-sensitive acid generator, along with optional components like an acid diffusion controller and solvent, to enhance water repellency and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional radiation-sensitive resin compositions are used, then sensitivity to exposure light is maintained, but water repellency and defect reduction are insufficient for miniaturized line widths of 40 nm or less
Solution Approach 1:
The patent uses a composite polymer system consisting of a first polymer (polycarboxylic acid or polyhydroxycarboxylic acid) and a second polymer (polymer with carboxyl group having specific glass transition temperature). This composite structure combines the water repellency properties of the first polymer with the structural stability provided by the second polymer, achieving both manufacturing precision and reliability for miniaturized patterns.
Solution Approach 2:
The patent specifies precise parameter ranges for the polymer components, including glass transition temperature (50°C to 150°C for the second polymer), carboxyl group content (0.1 to 10 mmol/g), and molecular weight ratios. By optimizing these parameters, the composition achieves improved water repellency and defect resistance while maintaining sensitivity for 40 nm or less line width fabrication.
2Manufacturing precision
If polymer types and molecular structures are optimized for LWR and CDU performance, then line width uniformity improves, but sensitivity to exposure light may be compromised
Solution Approach 1:
The patent assigns different functional properties to different polymer components: the first polymer (polycarboxylic acid or polyhydroxycarboxylic acid) provides water repellency and structural stability for LWR/CDU performance, while the second polymer (with carboxyl group and specific Tg) maintains sensitivity to exposure light. This local differentiation of functional qualities allows simultaneous optimization of both line width uniformity and exposure sensitivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of resist patterns with improved sensitivity, water repellency, and reduced defects, suitable for advanced semiconductor manufacturing.
Implementation Method 1
A radiation-sensitive resin composition for use in microfabrication by lithography generates an acid at a light-exposed region upon an irradiation with a radioactive ray, e.g., an electromagnetic wave such as a far ultraviolet ray such as an ArF excimer laser beam (wavelength of 193 nm), a KrF excimer laser beam (wavelength of 248 nm), etc., an extreme ultraviolet ray (EUV)
Implementation Method 2
A chemical reaction in which the acid serves as a catalyst causes a difference in rates of dissolution in a developer solution between light-exposed regions and light-unexposed regions, whereby a resist pattern is formed on a substrate
Data Source
AI summary
A radiation-sensitive resin composition includes: a first polymer including a structural unit which includes an acid-labile group; a second polymer including a structural unit represented by formula (1); and a radiation-sensitive acid generator. R1 represents a monovalent organic group having 1 to 20 carbon atoms; R2 represents a monovalent organic group having 1 to 20 carbon atoms; X represents a divalent organic group having 1 to 20 carbon atoms; and Y represents a divalent hydrocarbon group having 1 to 20 carbon atoms. The divalent organic group represented by X, the monovalent organic group represented by R2, or both has a fluorine atom.