Radiation-Sensitive Resin Composition for Lithography
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Solution Overview
Problem
Current radiation-sensitive resin compositions for microfabrication face challenges in achieving favorable sensitivity to exposure light and superior Line Width Roughness (LWR) and Critical Dimension Uniformity (CDU) performance, especially at line widths below 40 nm.
Innovation Solution
A radiation-sensitive resin composition comprising a polymer with an acid-labile structural unit and a radiation-sensitive acid generating agent, which alters solubility in a developer solution, is used, along with optional components like an acid diffusion control agent and a polymer with higher fluorine content, to enhance sensitivity and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional radiation-sensitive resin compositions are used, then manufacturing process is simple, but sensitivity to exposure light and LWR/CDU performance deteriorate at line widths below 40 nm
Solution Approach 1:
The patent employs a composite polymer system consisting of a first polymer containing acid-labile groups (for sensitivity and pattern formation) and a second polymer containing fluorinated groups (for LWR/CDU performance). This composite approach allows simultaneous achievement of high sensitivity and superior line width control by combining the functional benefits of different polymer materials with complementary properties.
Solution Approach 2:
The resin composition implements local quality differentiation through distinct polymer components with specialized functions: the first polymer provides acid generation and solubility change for pattern definition, while the second polymer contributes fluorinated chains for reduced line width roughness. Each component is optimized for its specific role, allowing the overall system to achieve multiple performance targets simultaneously.
2Ease of manufacture
If polymer structure is simplified for ease of manufacture, then manufacturing becomes easier, but sensitivity and pattern uniformity performance worsen
Solution Approach 1:
The patent segments the polymer system into two distinct functional components: a first polymer with acid-labile groups for sensitivity functions, and a second polymer with fluorinated side chains for LWR performance. Each polymer can be synthesized and characterized independently, simplifying the overall manufacturing process while maintaining the complex functional performance required for advanced lithography applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of resist patterns with improved sensitivity to exposure light and superior LWR and CDU performance, suitable for advanced semiconductor device microfabrication.
Implementation Method 1
generates an acid at light-exposed regions upon an irradiation with a radioactive ray, e.g., an electromagnetic wave such as a far ultraviolet ray such as an ArF excimer laser beam (wavelength of 193 nm), a KrF excimer laser beam (wavelength of 248 nm), etc. or an extreme ultraviolet ray (EUV) (wavelength of 13.5 nm), or a charged particle ray such as an electron beam
Implementation Method 2
A chemical reaction in which the acid serves as a catalyst causes a difference between the light-exposed regions and light-unexposed regions in rates of dissolution in a developer solution, whereby a resist pattern is formed on a substrate
Data Source
AI summary
The radiation-sensitive resin composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a structural unit represented by the following formula (1); and a radiation-sensitive acid generating agent. L represents a single bond, —COO—, —O—, or —CONH—. X represents a single bond, —O—, -G-O—, —CH2—, —S—, —SO2—, —NRA—, or —CONH—, wherein G represents a divalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, and RA represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 10 carbon atoms. R2 and R3 each independently represent a halogen atom, a hydroxy group, a sulfanyl group, or an organic group having 1 to 20 carbon atoms.