Radiation-Sensitive Resin Composition for EUV Resist Patterns
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Solution Overview
Problem
The existing radiation-sensitive resin compositions face challenges in achieving superior sensitivity and a broad process window, especially with the use of extreme ultraviolet rays and electron beams, due to slight fluctuations in exposure and development conditions, which can lead to defects in resist patterns.
Innovation Solution
A radiation-sensitive resin composition comprising a polymer with an acid-labile group, a radiation-sensitive acid generator, and a compound represented by a specific formula, which enhances sensitivity and process window through improved acid generation and diffusion control, allowing for the formation of resist patterns with superior sensitivity and a broader process latitude.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional radiation-sensitive resin compositions are used, then basic resist pattern formation is achieved, but sensitivity is insufficient for advanced microfabrication and process window is narrow
Solution Approach 1:
The patent uses a composite resin composition containing multiple polymer components: a first polymer with carboxylic acid groups (adhesive promoter), a second polymer with hydroxyl groups (solubility controller), and a third polymer with lactone structures (pattern adhesion enhancer). This multi-component composite approach achieves both high sensitivity and broad process window by combining the synergistic effects of different functional polymers.
Solution Approach 2:
The patent optimizes specific parameter ranges: carboxylic acid content (0.1-10 mmol/g), hydroxyl group content (0.1-5 mmol/g), lactone structure content (5-50 wt%), and polymer molecular weights. By precisely controlling these parameters, the composition achieves improved sensitivity while maintaining a broad process window that absorbs fluctuations in exposure and development conditions.
2Productivity
If exposure light intensity is increased to improve sensitivity, then pattern formation speed increases, but fluctuations in conditions have larger effects on pattern quality
Solution Approach 1:
The patent changes the chemical parameters of the resin composition by incorporating specific functional groups that enhance acid generation efficiency and control dissolution rates. This allows high sensitivity at moderate exposure intensities while maintaining precise pattern control, as the functional groups provide consistent chemical responses that reduce variability from exposure fluctuations.
Solution Approach 2:
The carboxylic acid groups and hydroxyl groups act as intermediary functional groups that mediate between the exposure light and the final pattern formation. These groups provide a buffer that absorbs fluctuations in exposure conditions and translates them into consistent dissolution behavior during development, thereby maintaining pattern quality across varying conditions.
3Ease of manufacture
If polymer structure is simplified to improve manufacturing, then adhesive performance and resolution are reduced
Solution Approach 1:
Instead of using a single complex polymer, the patent employs a composite of three relatively simple polymers, each with a specific functional role. This approach maintains ease of manufacture for each individual polymer while achieving superior overall performance through their synergistic combination, avoiding the need for synthesizing a single highly complex polymer structure.
Solution Approach 2:
The patent segments the adhesive and functional requirements into three separate polymer components, each optimized for a specific function. This segmentation allows each polymer to be manufactured using relatively simple, well-established synthesis methods, while the combination delivers the high resolution and adhesive performance that would require much more complex single-polymer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed composition enables the formation of resist patterns with enhanced sensitivity and a broader process window, suitable for advanced semiconductor manufacturing processes, improving the robustness against exposure and development condition fluctuations.
Implementation Method 1
generates an acid in a light-exposed region upon irradiation with exposure light, e.g., a far ultraviolet ray such as an ArF excimer laser, an extreme ultraviolet ray (EUV), or an electron beam
Implementation Method 2
improved acid generation and diffusion control
Data Source
AI summary
A radiation-sensitive resin composition contains: a polymer that includes a structural unit including an acid-labile group; a radiation-sensitive acid generator; and a compound represented by the following formula (1). In the following formula (1), R1 represents a hydrogen atom or a monovalent organic group having 1 to 30 carbon atoms; and Xn+ represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3. It is preferable that R1 in the following formula (1) represents an organic group, and that the organic group has a ring structure. It is preferable that R1 in the following formula (1) represents an organic group, and that the organic group is an acid-labile group. Xn+ in the following formula (1) preferably represents a sulfonium cation, an iodonium cation, or a combination thereof.


