Radiation Sensor Element Copper Pillar Interconnection

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Solution Overview

Problem

The back-end processing of solid-state radiation detectors poses challenges due to high resolution and layout density requirements, necessitating innovative solutions for efficient fabrication and integration of sensor elements.

Innovation Solution

A radiation sensor element comprising a support plate, substrate, sensor tile with an active material layer, copper-pillar interconnection elements, and a non-conductive film, where the non-conductive film laterally surrounds the copper-pillar interconnections and forms an edge protrusion part, facilitating mechanical stability and electrical connectivity while allowing for closer arrangement of sensor tiles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If sensor tiles are arranged with high layout density to improve detection resolution, then measurement precision is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvedetection resolutionVSAvoidlayout density
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The radiation detector is divided into multiple sensor tiles that can be independently manufactured and then assembled into a larger array. Each tile contains a simplified interconnection structure with copper pillars and non-conductive films, allowing high-resolution detection through close spacing without requiring each individual component to be complex.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interconnection structure transitions from planar traces to three-dimensional copper pillars with non-conductive film encapsulation. This vertical dimension allows for closer horizontal spacing of sensor tiles while maintaining electrical isolation, enabling higher layout density without proportionally increasing manufacturing complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If copper-pillar interconnection elements are used to improve electrical connectivity, then electrical conductivity is improved, but risk of electrical breakdown increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoidelectrical breakdown risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A non-conductive film is introduced as an intermediary material that laterally surrounds the copper-pillar interconnection elements. This film provides electrical isolation between adjacent copper pillars and sensor tiles, preventing electrical breakdown while maintaining the low-resistance vertical connection path through the copper pillars.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The interconnection structure combines conductive copper material with non-conductive film material to create a composite structure. The copper provides vertical electrical connectivity, while the non-conductive film provides lateral electrical isolation, achieving both connectivity and breakdown protection in a single integrated structure.

Inventive Principle:
Principle #40Composite materials

3Reliability

If non-conductive film laterally surrounds copper-pillar interconnection elements to reduce electrical breakdown risk, then reliability is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveelectrical breakdown protectionVSAvoidfilm placement accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The non-conductive film is applied in advance to cover the copper-pillar interconnection elements before final sensor tile assembly. This preliminary encapsulation ensures proper electrical isolation is established early in the manufacturing process, and subsequent assembly steps can proceed with standard precision requirements rather than requiring ultra-precise film placement.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11367746B2Radiation sensor element and method
Publication Date: 2022.06.21 DETECTION TECH LTD
  • US11367746B2 patent drawing
  • US11367746B2 patent drawing

AI summary

A radiation sensor element comprises a support plate, having a front face, extending substantially along a base plane, defining a lateral extension of the radiation sensor element; a substrate, having a basal face, an interconnection face opposite the basal face, and an edge face connecting the basal face and the interconnection face; a sensor tile, having a back face facing the interconnection face; a copper-pillar interconnection element between the interconnection face and the back face; and a non-conductive film extending between the interconnection face and the back face. The front face comprises, laterally beyond the edge face, a depression extending in a thickness direction perpendicular to the base plane, and the non-conductive film comprises an edge protrusion part extending in the depression.