Radiation Sensor Frame Structure for Sensitivity and Selectivity
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Solution Overview
Problem
Modern radiation sensors face challenges in achieving both high sensitivity and wavelength selectivity while being compact, as existing designs often expose side surfaces to radiation, leading to sensitivity reduction and inadequate radiation collection.
Innovation Solution
A radiation sensor design featuring a radiation impermeable frame surrounding the chip side surfaces and a radiation permeable layer extending laterally, with the frame minimally projecting over the chip edge, combined with a manufacturing method using FAM process to ensure optimal coverage and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a frame is used to cover side surfaces of the chip, then wavelength selectivity is improved, but sensitivity deteriorates due to shading of incident radiation
Solution Approach 1:
The frame covers only the necessary side surface area to prevent radiation bypass while minimizing projection over the chip upper surface. The frame height is controlled to be less than the chip thickness, providing partial coverage that achieves wavelength selectivity without excessive shading that would reduce sensitivity.
Solution Approach 2:
The frame is positioned specifically at the side surfaces and lower periphery of the chip, leaving the upper surface largely exposed. This localized placement provides radiation blocking where needed (side surfaces) while maintaining sensitivity (upper surface exposure).
2Volume of moving object
If the chip size is reduced for compact integration, then device size is improved, but radiation collection capability deteriorates
Solution Approach 1:
The radiation collection area is extended from the two-dimensional chip upper surface to include the three-dimensional side surfaces through the frame structure. This dimensional extension allows compact chips to maintain adequate radiation collection by utilizing vertical side surface area in addition to the horizontal upper surface area.
Solution Approach 2:
The frame is pre-configured with the appropriate height (less than chip thickness) and positioning to optimize radiation collection before the chip is integrated into the final device. This preliminary structuring ensures maximum radiation capture efficiency for the given chip size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances sensitivity by preventing radiation bypass and shading, while maintaining wavelength selectivity, and protects bond connections through frame integration, suitable for mechanically and thermally demanding environments.
Implementation Method 1
a radiation impermeable frame (16) joined to the chip side surfaces (11s) and surrounding the chip (11)
Implementation Method 2
A radiation permeable layer (17) is applied over the chip or (where present) over a filter layer located on the upper surface of the chip
Data Source
AI summary
A radiation sensor has a substrate, a radiation sensitive chip thereon, a radiation impermeable frame joined to the chip side surfaces and surrounding the chip, and a radiation permeable layer over the chip. The frame does not project or does not substantially project over the upper edge of the chip along a substantial part of its inner periphery. The radiation permeable layer value projects over the chip in the lateral direction and is on the frame or above it.