Radiation Image Sensor Substrate Segmentation for Interference Reduction
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Solution Overview
Problem
Radiation image capturing apparatuses face challenges with electrical interference and damage to circuit components due to bending during mechanical stripping of flexible sensor substrates, especially when digital and analog signal processing components are integrated on a single substrate.
Innovation Solution
The apparatus separates digital and analog signal processing components onto distinct substrates, with digital components on a flexible driving substrate and analog components on a non-flexible signal processing substrate, connected via flexible cables, to minimize interference and facilitate easy bending and stripping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If digital and analog signal processing components are integrated on a single substrate, then device complexity is reduced, but electrical interference and damage to components occur due to bending during mechanical stripping
Solution Approach 1:
The circuit substrate is divided into two separate substrates: a first circuit substrate for digital signal processing and a second circuit substrate for analog signal processing. This segmentation prevents electrical interference between digital and analog components while allowing each substrate to be optimized for its specific function, thereby resolving the contradiction between device complexity and reliability.
Solution Approach 2:
The analog signal processing components are extracted from the digital circuit substrate and placed on a separate second circuit substrate. This extraction eliminates the harmful electrical interference that would occur if both digital and analog components coexisted on the same substrate, especially during bending operations in mechanical stripping processes.
2Ease of manufacture
If mechanical stripping is performed with the circuit substrate electrically connected to the sensor substrate, then manufacturing process is simplified, but the circuit substrate and components are bent and damaged
Solution Approach 1:
The circuit system is segmented into multiple substrates connected by flexible cables, allowing the sensor substrate to be mechanically stripped from the support without forcing the rigid circuit substrates to bend. The flexible cables accommodate the bending motion during stripping while maintaining electrical connections, thus preserving component integrity while enabling simplified manufacturing.
Solution Approach 2:
Flexible cables serve as intermediaries between the sensor substrate and the circuit substrates. These cables can bend and flex during the mechanical stripping process, absorbing the mechanical stress that would otherwise be transmitted to the rigid circuit substrates and mounted components, thereby preventing damage while maintaining electrical connectivity.
3Weight of moving object
If a flexible base material is used in the sensor substrate, then weight is reduced and imaging is facilitated, but electrical interference occurs when connected to circuit components during bending
Solution Approach 1:
The system is segmented into the flexible sensor substrate and separate rigid circuit substrates connected by flexible cables. This segmentation isolates the flexible sensor substrate (which can bend without electrical interference) from the sensitive circuit components, allowing the weight benefits of the flexible base material to be realized while preventing electrical interference with the circuitry.
Solution Approach 2:
The sensitive analog circuit components are extracted from the flexible sensor substrate and placed on separate rigid circuit substrates. This extraction eliminates the electrical interference problem that would occur if analog components were present on the flexible substrate during bending, while the flexible sensor substrate retains its weight advantage for facilitated imaging.
Data Source
AI summary
A radiation image capturing apparatus includes a sensor substrate including a flexible base material and plural pixels that accumulate charges generated in accordance with radiation, a flexible first cable including one ends electrically connected to a connection region disposed at a predetermined side of the sensor substrate, a first circuit substrate electrically connected to the other end of the first cable and in which a first component used for processing a digital signal in a circuit unit driven in a case of reading out the charges in the plural pixels is mounted, a flexible second cable including one end electrically connected to a connection region disposed at a side different from the predetermined side, and a second circuit substrate electrically connected to the other end of the second cable and in which a second component used for processing an analog signal in the circuit unit is mounted.