Radiation Sensor Device Transparent Cap Segmentation
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Solution Overview
Problem
Conventional radiation sensor devices are expensive and use packaging that is not transparent to the radiation being sensed, making them unsuitable for integrated circuit chips with radiation sensors, and they suffer from mold bleed issues during encapsulation.
Innovation Solution
A radiation sensor device is created using industry-standard packaging with a cap attached to the integrated circuit chip, where at least one portion of the cap or chip is transparent to the radiation, and the assembly is encapsulated in a material like plastic epoxy, with a sacrificial layer or compliant mold insert to prevent mold bleed and protect the transparent area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional integrated circuit packaging with epoxy encapsulation is used, then manufacturing cost is reduced, but the packaging becomes opaque to radiation and unsuitable for radiation sensing
Solution Approach 1:
The packaging is segmented into distinct functional zones: a radiation-transparent cap region allowing radiation entry, and an epoxy encapsulation region providing mechanical protection. This segmentation enables simultaneous achievement of radiation transparency and cost-effective manufacturing by using inexpensive epoxy only where structural protection is needed, not where radiation transmission is required.
Solution Approach 2:
Different regions of the packaging have different optical properties: the cap portion is made transparent to radiation (using materials like glass or transparent plastic) while the epoxy encapsulation remains opaque. This local differentiation of material properties allows the packaging to simultaneously provide both radiation transparency where needed and mechanical protection where required, resolving the contradiction between cost and radiation transparency.
2Productivity
If the cap is placed close to the radiation sensor for efficient radiation sensing, then radiation sensing efficiency is improved, but mold bleed occurs during encapsulation
Solution Approach 1:
The cap is attached to the integrated circuit chip before the encapsulation process. This preliminary attachment establishes a fixed reference position for the cap relative to the chip, creating a stable structure that prevents mold bleed during subsequent epoxy encapsulation while maintaining the cap's close proximity to the radiation sensor for efficient radiation sensing.
Solution Approach 2:
The cap serves as an intermediary element between the radiation sensor and the external environment. By attaching the cap to the chip first, it acts as a protective intermediary during encapsulation that prevents mold bleed from contaminating the radiation-sensitive areas, while still allowing efficient radiation transmission to the sensor.
3Manufacturing precision
If the cap is spaced from the radiation sensor to prevent mold bleed, then manufacturing precision is improved, but radiation sensing efficiency decreases
Solution Approach 1:
The cap is attached to the chip before encapsulation in a precise position that optimizes radiation sensing. This preliminary positioning ensures the cap is close enough to the sensor for efficient radiation detection while establishing protective spacing or barriers that prevent mold bleed during the subsequent encapsulation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a cost-effective, efficient radiation sensor device that enhances radiation sensing by allowing radiation to pass through transparent portions, minimizing mold bleed, and protecting the sensitive areas from mechanical damage.
Implementation Method 1
at least one of the cap and integrated circuit chip have at least a portion proximate the radiation sensor which is transparent to the radiation to be sensed
Data Source
AI summary
An improved radiation sensor device includes a cap attached to an integrated circuit chip which has a radiation sensor on a surface with a cap spaced from and covering the radiation sensor; the cap and integrated circuit chip with radiation sensor are encapsulated in an encapsulant with a transparent portion of at least one of the cap and integrated circuit chip proximate the radiation sensor being exposed at the boundary of the encapsulant.