Radiation-Shielded IC Package for X-Ray Sensor Protection
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Solution Overview
Problem
Integrated device dies in imaging systems, such as X-ray and CT imaging, are vulnerable to damage from electromagnetic radiation, which existing technologies have not adequately addressed, leading to performance degradation.
Innovation Solution
A shielded integrated device package is designed with a radiation shield attached to the package substrate using an adhesive, encompassing the integrated device die to prevent electromagnetic radiation from reaching sensitive active circuitry, utilizing materials like tungsten or molybdenum for effective shielding, with the shield's size and thickness optimized to block at least 75% of X-ray radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a radiation shield is added to protect the integrated device die, then the protection level against electromagnetic radiation is improved, but the device complexity increases
Solution Approach 1:
The radiation shield is integrated with the package substrate by attaching it to the backside, merging the shielding function with the existing package structure. This approach provides radiation protection while minimizing additional complexity by utilizing the substrate as the mounting platform for the shield.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the device die, electrical connections through contact pads, and serves as a mounting platform for the radiation shield. This multi-functionality reduces overall device complexity by consolidating multiple functions into a single component.
2Reliability
If a radiation shield is attached to the package substrate, then the protection against electromagnetic radiation is improved, but the manufacturing complexity increases
Solution Approach 1:
The radiation shield is attached to the backside of the package substrate before the device die is mounted on the front side. This preliminary action simplifies manufacturing by establishing the shielding structure first, providing a stable base for subsequent assembly steps and reducing the complexity of integrating the shield later in the process.
3Reliability
If the integrated device die is mounted on the radiation shield, then the protection against electromagnetic radiation is improved, but the device complexity increases
Solution Approach 1:
The device is segmented into distinct functional layers: the package substrate with contact pads, the radiation shield attached to the backside, and the device die mounted on the front side. This segmentation allows each component to be optimized independently and simplifies the overall assembly process by clearly defining the function and position of each element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage to the integrated device die by blocking significant amounts of electromagnetic radiation, ensuring the integrity and performance of the circuitry in imaging systems, and can be applied in various radiation-susceptible applications.
Implementation Method 1
a radiation shield attached to a package substrate by way of an adhesive
Implementation Method 2
the radiation shield...encompassing the integrated device die to prevent electromagnetic radiation from reaching sensitive active circuitry
Data Source
AI summary
An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.