Radiation Detector Substrate Support for Thermal Stress Relief

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Radiation detectors with thin semiconductor substrates face challenges in maintaining mechanical strength and ensuring reliable electrical bonding due to differences in linear expansion coefficients between materials, leading to potential damage from thermal stress and reduced bonding reliability.

Innovation Solution

The electronic component employs a first support member to interpose between the semiconductor substrate and a second support member, using the same material as the substrate for mechanical strength and electrical connection, with through electrodes and conductor layers to facilitate reliable bonding and reduce thermal stress, while also using an adhesive layer for bonding and a resin to protect the wire connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the semiconductor substrate is made thin to reduce crosstalk and improve detection accuracy, then the mechanical strength of the semiconductor substrate decreases

Engineering Contradiction:

Improvedetection accuracyVSAvoidmechanical strength

Core Design Contradiction:

Measurement precisionVSStrength

Solution Approach 1:

A support substrate is introduced as an intermediary component between the thin semiconductor substrate and the external environment. The support substrate has a first main surface that contacts the second main surface of the semiconductor substrate and a second main surface that contacts a package substrate, providing mechanical support to the thin semiconductor substrate without interfering with its detection function

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The support substrate is made of the same material as the semiconductor substrate. This material homogeneity ensures compatible thermal expansion coefficients, reducing thermal stress at interfaces during temperature changes, and maintains electrical properties for reliable wire bonding connections

Inventive Principle:

Principle #33Homogeneity

2Adaptability or versatility

If different materials are used for the semiconductor substrate, package, and sealing resin, then the linear expansion coefficients differ, causing tension at the wire bonding portion and deteriorating bonding reliability

Engineering Contradiction:

Improvematerial selection flexibilityVSAvoidbonding reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The support substrate is made of the same material as the semiconductor substrate, creating a homogeneous material structure in the critical bonding region. This ensures matching thermal expansion coefficients between the support substrate and semiconductor substrate, eliminating differential thermal stress that would otherwise damage the wire bonding connections during temperature cycling

Inventive Principle:

Principle #33Homogeneity

Solution Approach 2:

The support substrate acts as an intermediary layer between the semiconductor substrate and the package substrate. This intermediary structure provides a stable bonding surface for wire connections, isolating the bonding region from the thermal expansion differences between the semiconductor substrate and the package materials

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances both the mechanical strength and electrical bonding reliability of the semiconductor substrate, reducing the impact of thermal stress and improving handling reliability by using the same material for the support member and substrate, and protecting the wire connections from external interference.

Implementation Method 1

a first support member 20 having a third main surface 201 and a fourth main surface 202, at least a partial portion of the third main surface supporting at least a partial portion of the second main surface of the semiconductor substrate

Methodology Applied

Scientific EffectMechanical support:

Implementation Method 2

the first support member includes a through electrode configured to electrically connect the first connection part and the second connection part to each other

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

using an adhesive layer for bonding

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 4

and a resin to protect the wire connections

Methodology Applied

Scientific EffectPhysical protection:

Data Source

PatentUS20250022906A1Electronic component, radiation detector, and radiation imaging system

Publication Date: 2025.01.16 CANON KK

AI summary

An electronic component includes a first support member having a third main surface and a fourth main surface, at least a partial portion of the third main surface supporting at least a partial portion of the second main surface of the semiconductor substrate, and a second support member having a fifth main surface and a sixth main surface, at least a partial portion of the fifth main surface supporting at least a partial portion of the fourth main surface of the first support member. In a case where the electronic component is seen through from a direction perpendicular to the first main surface, the semiconductor substrate has a first region and a second region adjoining an outer side of the first region, the semiconductor substrate does not overlap any of the first support member and the second support member in the first region.