Radiation Thermometer Holder with Angle Adjustment Mechanism
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Solution Overview
Problem
Conventional heat treatment apparatuses for semiconductor wafers face challenges in precisely measuring the temperature of specific positions on the wafer surface due to imprecise placement of radiation thermometers, leading to unreliable temperature measurements, especially after maintenance or reinstallation.
Innovation Solution
A heat treatment apparatus with a cylindrical radiation thermometer and a holder equipped with a tension spring and an angle adjusting mechanism, allowing precise adjustment of the thermometer's position on the substrate surface, and a susceptor with openings to reduce the influence of thin films on emissivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a radiation thermometer is merely mounted in a predetermined location of a heat treatment apparatus, then the device complexity is reduced, but the measurement precision deteriorates because the measurement position cannot be assured to be a specified position lying within a wafer surface
Solution Approach 1:
The holder is designed with an angle adjusting mechanism that allows the radiation thermometer to be dynamically adjusted to a predetermined angle relative to the wafer surface. This dynamic adjustability ensures that the measurement position can be precisely controlled to correspond to a specified position on the wafer surface, thereby improving measurement precision without requiring a overly complex fixed structure
Solution Approach 2:
The holder includes an angle adjusting mechanism that changes the angular parameter of the radiation thermometer's orientation. By adjusting the angle parameter, the measurement position on the wafer surface can be precisely controlled to match the specified position, resolving the contradiction between measurement precision and device complexity
2Ease of repair
If a radiation thermometer is removed for maintenance and then mounted again, then the ease of repair is improved, but the reliability deteriorates because the reproducibility of the measurement position becomes unreliable
Solution Approach 1:
The holder is pre-adjusted to a predetermined angle that corresponds to a specified position on the wafer surface before the radiation thermometer is installed. This preliminary setup ensures that when the thermometer is removed for maintenance and reinstalled, it automatically returns to the correct measurement position, maintaining reliability while allowing easy maintenance
Solution Approach 2:
The holder's angle adjusting mechanism is designed to maintain its adjusted position without requiring complex locking or calibration procedures. This self-maintaining feature allows the radiation thermometer to be easily removed and reinstalled while automatically preserving the predetermined measurement position, thus ensuring both ease of repair and measurement reliability
3Measurement precision
If the radiation thermometer is provided to receive infrared radiation from the substrate, then the temperature measurement capability is achieved, but the object-affected harmful factors worsen due to the influence of thin films on emissivity
Solution Approach 1:
The holder positions the radiation thermometer at a specific local angle relative to the wafer surface, creating a localized measurement geometry that minimizes the influence of thin films on emissivity. By controlling the local measurement conditions through precise angular positioning, the harmful effects of thin films are reduced while maintaining temperature measurement capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and reproducible temperature measurement at predetermined positions on the substrate surface, improving the accuracy and reliability of temperature control during the heat treatment process.
Implementation Method 1
a radiation thermometer of a cylindrical shape for receiving infrared radiation emitted from the substrate to measure the temperature of the substrate
Implementation Method 2
the holder includes a tension spring for pressing the radiation thermometer against the holder from the rear end of the lower radiation thermometer toward the front end thereof
Implementation Method 3
The xenon flash lamps have a spectral distribution of radiation ranging from ultraviolet to near-infrared regions. The wavelength of light emitted from the xenon flash lamps is shorter than that of light emitted from conventional halogen lamps, and approximately coincides with a fundamental absorption band of a silicon semiconductor wafer. Thus, when a semiconductor wafer is irradiated with a flash of light emitted from the xenon flash lamps, the temperature of the semiconductor wafer can be raised rapidly
Data Source
AI summary
A pyrometer holder is mounted to an outer wall of a chamber while holding a lower radiation thermometer. The front end of the lower radiation thermometer is brought into abutment with a mounting portion of the pyrometer holder, and a bottom plate is brought into abutment with the rear end of the lower radiation thermometer. A tension spring is tensioned between the bottom plate and the mounting portion to prevent the lower radiation thermometer from falling off or misregistration. An angle adjusting mechanism adjusts the angle of the radiation thermometer with respect to the outer wall of the chamber, with the front end of the radiation thermometer serving as a supporting point. Thus, the measurement position of the lower radiation thermometer is adjusted.