Radiation Thermometer Stacked Circuit for Noise-Resistant Miniaturization
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Solution Overview
Problem
Existing radiation thermometers face challenges in downsizing while maintaining circuit scale and are vulnerable to electromagnetic noise due to limited circuit accommodation and analog signal transmission.
Innovation Solution
The radiation thermometer is configured with a signal processing unit stacked by multiple substrates separated by spacers, using inter-substrate connectors, and fixed with elastic members to enhance circuit scale and resistance to electromagnetic noise, with heat dissipation and thermal separation of components to reduce measurement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the measurement unit is downsized to accommodate only the infrared sensor or minimum circuit, then the size of the radiation thermometer is reduced, but the configuration becomes weak against electromagnetic noise due to analog signal transmission
Solution Approach 1:
The patent transitions from analog signal transmission to digital signal transmission by incorporating an A/D conversion unit within the measurement unit. This dimensional change in signal processing architecture enables the system to maintain compact size while achieving immunity to electromagnetic noise, as digital signals are inherently more resistant to interference than analog signals.
Solution Approach 2:
The patent merges the signal processing functions (amplification and A/D conversion) directly into the measurement unit by integrating them on the same substrate as the infrared sensor. This consolidation eliminates the need for separate external processing units and analog cable connections, thereby reducing overall system size while simultaneously improving electromagnetic noise resistance through digital transmission.
2Device complexity
If multiple substrates are stacked to increase circuit scale, then the circuit functionality is enhanced, but excessive stress is applied to the substrates during fixation
Solution Approach 1:
The patent employs flexible cushioning members (elastic members) between the stacked substrates and the casing to distribute mechanical stress during fixation. These elastic members act as compliant elements that absorb excessive stress, preventing damage to the substrates while still maintaining secure mechanical attachment of the multi-layer circuit structure.
3Strength
If substrates are fixed by screwing to secure the stacked configuration, then the mechanical attachment is strong, but excessive stress is applied causing unstable fixation
Solution Approach 1:
The patent replaces rigid screw fixation with flexible elastic members that provide compliant mechanical attachment. These elastic members maintain strong attachment force while accommodating thermal expansion and manufacturing tolerances, thereby achieving both strong mechanical attachment and stable long-term fixation without causing substrate damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration allows for downsizing and increased circuit scale with resistance to electromagnetic noise, improving measurement accuracy and reducing temperature drift and thermal interference.
Implementation Method 1
the radiation thermometer is configured to detect infrared rays emitted from a measurement target with an infrared detection element (infrared sensor) so as to be able to measure the temperature of the measurement target based on the detected intensity
Implementation Method 2
the elastic member press the plurality of substrates from a direction in which the plurality of substrates are stacked
Implementation Method 3
the heat generated in the substrate is transmitted to the infrared sensor, and the output of the infrared sensor drifts
Data Source
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AI summary
The present invention downsizes a radiation thermometer and increases a circuit scale, and includes: an infrared sensor 2; a signal processing unit 4 that processes a signal of the infrared sensor 2; and a casing 5 that accommodates the infrared sensor 2 and the signal processing unit 4, in which the signal processing unit 4 is configured by stacking a plurality of substrates 41 to 44 with a spacer 45 interposed therebetween.