Radiator Fin Structure for Electronic Device Heat Dissipation

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Solution Overview

Problem

Existing electronic devices face inadequate heat dissipation efficiency, leading to increased temperatures and potential device failure due to the reliance on fans and heat dissipation fins alone.

Innovation Solution

The electronic device incorporates a radiator with a unique fin structure and an air current generator, where the second air inlet is positioned between the geometrical middle side and the first lateral side, enhancing the heat exchange area and time, and utilizing the Bernoulli Principle to draw in cold air for improved heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If only a fan and heat dissipation fins are used for heat dissipation, then the device structure remains simple, but the heat dissipation efficiency is inadequate

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddevice structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The radiator body is divided into multiple fins that extend from the first air inlet toward the air outlet, creating multiple heat exchange surfaces. This segmentation increases the heat dissipation area without significantly increasing overall device complexity, as the fins are integrated into the radiator body structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a third lateral side with a second air inlet, adding a dimensional aspect to the heat dissipation structure. This creates a three-dimensional heat exchange pathway where air can enter from multiple directions (first lateral side and third lateral side) and exit from the opposite second lateral side, significantly improving heat dissipation efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If the second air inlet is positioned between the geometrical middle side and the first lateral side, then the heat exchange area and time are increased, but the device structure becomes more complex

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidradiator structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The second air inlet is specifically positioned between the geometrical middle side and the first lateral side of the radiator body, creating a localized optimization of the heat exchange structure. This strategic positioning ensures that the second air current has optimal interaction with the fins, maximizing heat exchange area and time in that specific region without complicating the overall device structure.

Inventive Principle:
Principle #3Local quality

3Loss of energy

If multiple air inlets and fins are incorporated to enhance heat dissipation, then heat dissipation efficiency improves, but the device occupies more space

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoiddevice volume
Core Design Contradiction:
Loss of energyVSVolume of stationary object

Solution Approach 1:

The multiple fins are nested within the radiator body, with each fin extending from the first air inlet toward the air outlet. This nested arrangement allows multiple heat exchange surfaces to be contained within a compact volume, improving heat dissipation efficiency without proportionally increasing the device volume.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

By adding the third lateral side with the second air inlet, the patent utilizes three-dimensional space more efficiently. The air flow paths are arranged in different spatial dimensions, allowing enhanced heat dissipation within a compact footprint by exploiting vertical and lateral space rather than only horizontal expansion.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly enhances heat dissipation efficiency by increasing the heat exchange area and time, effectively managing heat buildup and preventing device overheating.

Implementation Method 1

The radiator is disposed inside the case and is in thermal contact with the heat source

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The air current generator generates a first air current flowing from the first air inlet of the body toward the air outlet of the body

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

By the difference between the pressure inside the body and the pressure outside the case, the first air current sucks a second air current outside the case

Methodology Applied
Scientific EffectBernoulli principle: Bernoulli Effect

Data Source

PatentUS9119323B2Electronic device
Publication Date: 2015.08.25 INVENTEC PUDONG TECH CORPOARTION
  • US9119323B2 patent drawing
  • US9119323B2 patent drawing
  • US9119323B2 patent drawing

AI summary

An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.