Radiator-Integrated Substrate Warpage Control via Dynamic Pressure
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Solution Overview
Problem
Conventional manufacturing methods for radiator-integrated substrates face challenges such as insufficient warpage suppression, increased production costs, and reduced heat radiation performance due to high surface pressures and complex vacuum processes, particularly when dealing with large-sized metal-ceramic bonded substrates and porous pipe radiators.
Innovation Solution
A manufacturing method involving a ceramic substrate with a long side of 50 mm or more, where the metal circuit board and metal base plate are bonded using a molten metal bonding method, and the radiator is bonded via braze-bonding with a brazing material, applying a surface pressure of 1.0 N/mm² to 5.0 N/mm², ensuring a warpage of 2 μm/mm or less on the metal circuit board's front surface, and utilizing a thickness ratio of metal base plate to circuit board of 2:1 to 6:1 for enhanced heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high surface pressure (8-100 kgf/cm²) is applied during bonding to suppress warpage, then bonding strength is improved, but the partition plate of the radiator deforms and heat radiation performance decreases
Solution Approach 1:
The patent applies a specific surface pressure range (1.0-5.0 N/mm²) during bonding to achieve optimal balance between bonding strength and warpage suppression without deforming the radiator partition plate, replacing the conventional high pressure (8-100 kgf/cm²) approach
Solution Approach 2:
The patent introduces a curvature radius parameter (R ≥ 6500 mm) for the convex projection to dynamically control the pressure distribution during bonding, allowing the system to adapt between bonding strength and warpage suppression based on geometric parameters
2Manufacturing precision
If vacuum processes and complex bonding methods are used to achieve precise bonding, then bonding precision is improved, but production cost increases
Solution Approach 1:
The patent employs a self-aligning mechanism where the convex projection on the metal circuit board automatically positions itself against the concave groove on the radiator during bonding, eliminating the need for complex vacuum processes or precision alignment equipment
Solution Approach 2:
The convex projection and concave groove act as intermediary alignment features that facilitate precise bonding without requiring complex bonding equipment or processes, simplifying the manufacturing procedure
3Area of stationary object
If the size of the metal-ceramic bonded substrate is increased, then heat radiation area is improved, but warpage suppression becomes insufficient
Solution Approach 1:
The patent uses the curvature radius (R ≥ 6500 mm) of the convex projection as a dynamic parameter that scales with substrate size, maintaining effective pressure distribution and warpage suppression across different substrate dimensions while preserving heat radiation area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces warpage and processing costs while maintaining excellent strength and heat radiation performance, ensuring reliable bonding and efficient heat dissipation in radiator-integrated substrates.
Implementation Method 1
bonding of a metal circuit board and a metal base plate to a ceramic substrate is performed by a molten metal bonding method
Implementation Method 2
boding of the metal base plate and a radiator is performed by a braze-bonding method
Implementation Method 3
heat generated from the electronic component and so on is released to air, cooling water or the like by the heat radiation fin or the cooling jacket (radiator) via the metal-ceramic insulating substrate, the solder and the base plate
Implementation Method 4
heat generated from the electronic component and so on is released to air, cooling water or the like by the heat radiation fin or the cooling jacket (radiator)
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500 ≦ R ≦ surface pressure (N/mm2) × 2000 + 12000.