Radical-Curable Adhesive Composition for High-Temperature Bonding
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Solution Overview
Problem
Conventional adhesive compositions fail to produce cured products with superior adhesive strength under high-temperature conditions and suffer from inadequate thermal shock resistance, often requiring surface treatment of substrates which can lead to damage and increased costs.
Innovation Solution
A radical-curable adhesive composition containing a rubber with (meth)acryloyl groups, a polymerizable monomer with both an epoxy group and a (meth)acryloyloxy group, a radical polymerization initiator, and an acicular filler with specific fiber length and aspect ratio, which eliminates the need for substrate surface treatment and enhances thermal shock resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesive compositions are used, then adhesive strength can be achieved under normal conditions, but adhesive strength deteriorates under high-temperature conditions and thermal shock
Solution Approach 1:
The patent uses a composite adhesive system combining vinyl ester resin (providing heat resistance and mechanical strength) with rubber particles (providing flexibility and thermal shock resistance). This composite structure allows the cured adhesive to maintain strong bonding to metals while resisting degradation at high temperatures and under thermal shock conditions.
Solution Approach 2:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific ratios of vinyl ester resin (1% to 30% by mass) and rubber (1% to 30% by mass), along with radical generators. These parameter changes enable the cured adhesive to achieve both high-temperature stability and thermal shock resistance while maintaining adhesive strength.
2Strength
If surface treatment is applied to substrate, then adhesive strength is improved, but substrate may suffer damage and costs increase
Solution Approach 1:
The adhesive composition itself provides the surface preparation function through its chemical composition. The vinyl ester resin and rubber combination creates a formulation that can bond directly to metal surfaces without requiring external surface treatments like sanding, corona, or plasma treatments. The adhesive's molecular structure enables direct adhesion to substrates while maintaining superior bonding strength.
Solution Approach 2:
The patent removes the need for separate surface treatment steps from the bonding process. By designing an adhesive composition with inherent surface-active properties through the vinyl ester resin and rubber combination, the process eliminates the harmful surface treatment steps while achieving equivalent or superior adhesive strength.
3Strength
If surface treatment is applied to substrate, then adhesive strength is improved, but processing time and costs increase
Solution Approach 1:
The patent combines the adhesive formulation with surface-active properties, merging the functions of surface preparation and adhesion into a single material. This eliminates the need for separate surface treatment steps (sanding, corona, plasma, etc.), reducing processing time and steps while achieving superior adhesive strength through the vinyl ester resin and rubber combination.
4Strength
If surface treatment is applied to substrate, then adhesive strength is improved, but manufacturing costs increase
Solution Approach 1:
The patent removes the need for expensive surface treatment equipment and processes (sanding machines, corona treaters, plasma generators) from the manufacturing line. The vinyl ester resin-based adhesive composition provides inherent surface-active properties that enable direct bonding to substrates, eliminating capital equipment costs and operational expenses associated with surface treatments while achieving superior adhesive strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition achieves superior adhesive strength and thermal shock resistance without substrate surface treatment, suitable for high-temperature applications in electric and electronic components and transport devices.
Implementation Method 1
a radical polymerization initiator (c)
Data Source
AI summary
A radical-curable adhesive composition comprising a rubber (a) having one or more (meth)acryloyl groups within a single molecular chain thereof, a polymerizable monomer (b) having both an epoxy group and a (meth)acryloyloxy group in a molecule thereof, a radical polymerization initiator (c) and an acicular filler (d) having a fiber length of 500 to 2000 µm and an aspect ratio of 5 to 300.