Radically Curable Compound for High Heat Resistance
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Solution Overview
Problem
Current solder resists and nano-imprint materials face challenges with heat resistance, particularly in the electronic and liquid crystal display fields, where high heat resistance and mechanical properties are required, and existing materials like epoxy (meth)acrylate resins do not meet the increasing demands for advanced thermal nano-imprint methods.
Innovation Solution
A radically curable compound is developed through the reaction of a polycondensate of alkyl-substituted phenol and aromatic aldehyde with (meth)acrylic acid halide, which provides a cured product with high heat resistance, mechanical properties, and photocurability, suitable for applications in solder resists and nano-imprint materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If epoxy (meth)acrylate resins having a biphenyl skeleton are used to achieve high heat resistance, then heat resistance is improved, but the heat resistance level is still insufficient for recent requirements
Solution Approach 1:
The invention changes the chemical structure parameters of the resin by introducing specific aromatic rings (naphthalene, anthracene, phenanthrene) and controlling the substitution patterns of alkyl groups. These structural parameter changes result in cured products with glass transition temperatures of 200°C or higher, exceeding the heat resistance of conventional epoxy acrylate resins
Solution Approach 2:
The invention creates composite molecular structures by combining polycondensates of alkyl-substituted phenols and aromatic aldehydes with (meth)acrylic acid halides. This composite approach integrates the thermal stability of aromatic structures with the reactivity of acrylic groups, achieving both high heat resistance and curability
2Manufacturing precision
If the thermal nano-imprint method is used to form nano-patterns, then patterning capability is improved, but the method requires heating and cannot use polymeric resins with high glass transition temperature
Solution Approach 1:
The invention replaces the thermal softening mechanism with a photocuring mechanism. The composition contains photopolymerization initiators that enable curing upon light irradiation without requiring thermal softening, allowing the use of resins with high glass transition temperatures that would otherwise be incompatible with thermal nano-imprint methods
Solution Approach 2:
The invention changes the curing mechanism from thermal to optical by incorporating photopolymerization initiators and using (meth)acrylic functional groups that are responsive to light rather than heat. This parameter change in the curing activation method enables nano-imprint patterning with high-heat-resistant materials
3Temperature
If a cured product with very high heat resistance is produced, then heat resistance is improved, but the compound structure becomes more complex and difficult to synthesize
Solution Approach 1:
The invention segments the synthesis into two independent stages: first forming the polycondensate structure with desired aromatic and alkyl groups, then introducing the (meth)acrylic functional groups through reaction with (meth)acrylic acid halide. This segmentation allows independent optimization of each stage and simplifies the overall synthesis of complex high-performance compounds
Solution Approach 2:
The invention performs preliminary polycondensation to build the complex aromatic-alkyl core structure before introducing the reactive (meth)acrylic groups. This preliminary action separates the structural design phase from the functionalization phase, making the synthesis of complex heat-resistant compounds more manageable and efficient
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting cured product exhibits exceptional heat resistance, mechanical properties, and solvent solubility, making it suitable for high-temperature applications such as thermal nano-imprint methods and hard coating materials for displays, with a glass transition temperature of 400°C or more, surpassing traditional epoxy acrylate materials.
Implementation Method 1
a cured product produced by curing the radically curable compound with active energy rays or heat
Data Source
Figure 1~2
Figure 3
AI summary
An object of the present invention is to provide a radically curable compound which produces cured products with excellent heat resistance, and in order to achieve the object, the present invention provides a radically curable compound represented by general formula (1) below. (In the formula, R1 and R2 are each independently an alkyl group having 1 to 8 carbon atoms, R3 and R4 are each independently a hydrogen atom or a methyl group, m and n are each independently an integer of 1 to 4, and X is an aromatic hydrocarbon group or an aromatic hydrocarbon group substituted by an alkyl group having 1 to 8 carbon atoms.)