Radio Module Antenna Thickness Layout Against Resin Deformation
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Solution Overview
Problem
The existing radio communication modules face defects such as deformation of the radiation plate when the radiation plate and circuit board are separated and sealed with insulating resin, leading to compromised communication characteristics.
Innovation Solution
A radio communication module design featuring a circuit board with a first radiation conductor of increased thickness, positioned away from the main surface, and covered by insulating resin, which maintains structural integrity and communication performance by preventing deformation under stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the radiation plate is disposed apart from the circuit board and sealed with insulating resin, then the radiation plate can be positioned away from the main surface for improved radiation characteristics, but deformation of the radiation plate occurs due to stress from the insulating resin
Solution Approach 1:
The invention changes the thickness parameter of the radiation plate from a thin configuration to a thick configuration. This parameter change increases the mechanical strength and rigidity of the radiation plate, enabling it to resist deformation caused by the insulating resin while maintaining its positioned away from the circuit board for improved radiation characteristics
Solution Approach 2:
The invention emphasizes the thickness dimension of the radiation plate by making it substantially larger than the thickness of the circuit board. This dimensional change in the thickness direction provides the radiation plate with sufficient mechanical strength to maintain its shape and position when sealed with insulating resin, while still allowing it to be disposed apart from the circuit board for optimal radiation performance
2Strength
If the radiation plate thickness is increased to prevent deformation, then structural integrity is improved, but the overall device size and material usage increase
Solution Approach 1:
The invention applies local quality by making the radiation plate thick only in the regions where mechanical strength is needed to resist deformation from the insulating resin, while maintaining the ability to be positioned away from the circuit board. This localized thickness optimization provides structural integrity without unnecessarily increasing material usage throughout the entire radiation plate
Data Source
AI summary
A radio communication module is provided that includes a circuit board, a first radiation conductor, and an insulating resin. In the circuit board, a first main surface and a second main surface are included, and a second radiation conductor is provided on the second main surface of the circuit board. The first radiation conductor is flat and is provided near the first main surface. The insulating resin is provided near the first main surface side. The thickness of the first radiation conductor is larger than the thickness of the second radiation conductor.