Radio Module Fan-Housing Cooling for High-Power Heat Control
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Solution Overview
Problem
The high power consumption and heat generation by radio modules in information handling systems, particularly 5G radio modules, lead to cooling challenges that can damage the modules and increase chassis temperature, posing safety risks.
Innovation Solution
A cooling system is implemented using a fan housing that combines conductive and convective cooling methods, where the radio module is thermally coupled to the fan housing, allowing heat dissipation through both conductive and convective means, with airflow directed through fins and a heat pipe.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If radio module power consumption is increased to improve wireless communication performance, then communication capability is improved, but heat generation increases causing module damage and chassis temperature rise
Solution Approach 1:
The patent combines the radio module housing with the cooling fan housing to create an integrated thermal management system. The radio module is positioned within the fan housing structure, allowing direct thermal coupling between the radio module and the cooling fan, thereby merging the housing functions and enabling efficient heat dissipation through the fan's airflow path
Solution Approach 2:
The patent introduces a heat pipe as an intermediary thermal conduction element between the radio module and the cooling fan housing. The heat pipe transfers heat from the radio module to the fan housing structure, which then conducts heat to the airflow generated by the cooling fan, creating an efficient thermal pathway that mediates heat removal from the radio module
2Power
If radio module power consumption is increased to improve wireless communication performance, then communication capability is improved, but reliability decreases due to heat-induced module damage
Solution Approach 1:
The patent merges the radio module housing with the cooling fan housing to create an integrated thermal management system. This integration ensures that the radio module operates within a controlled thermal environment, with direct thermal coupling to the cooling fan, thereby maintaining module reliability even at high power consumption levels
Solution Approach 2:
The heat pipe serves as a reliable thermal intermediary that efficiently transfers heat from the radio module to the cooling fan housing. This reliable thermal pathway ensures consistent heat removal, preventing heat-induced module damage and maintaining operational reliability under high power conditions
3Power
If radio module power consumption is increased to improve wireless communication performance, then communication capability is improved, but safety risks increase due to chassis temperature rise
Solution Approach 1:
By merging the radio module housing with the cooling fan housing, the patent creates a unified thermal management structure that directly channels cooling airflow to the radio module. This integration ensures that heat generated by the radio module is immediately extracted and dissipated, preventing chassis temperature rise even when the radio module operates at high power levels
Solution Approach 2:
The heat pipe acts as a thermal intermediary that efficiently conducts heat away from the radio module to the cooling fan housing structure. This thermal mediation prevents heat accumulation in the chassis, thereby eliminating safety risks associated with high chassis temperatures while allowing the radio module to operate at high power
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools the radio module, preventing damage and reducing chassis temperature, ensuring user safety and maintaining system performance.
Implementation Method 1
the radio module is thermally coupled to the fan housing, allowing heat dissipation through both conductive and convective means
Implementation Method 2
allowing heat dissipation through both conductive and convective means, with airflow directed through fins and a heat pipe
Data Source
AI summary
An information handling system with a cooling system may include a processor, a memory; a power management unit (PMU) operatively coupled to the processor; a cooling fan operatively coupled to the processor to draw air into and direct air out of a base chassis of the information handling system, the cooling fan including a fan housing; and a radio module operatively coupled to the fan housing to be cooled by conduction to the fan housing and operation of the fan via convective cooling.


