Radiographic Imaging Apparatus Flexible Substrate Cable Routing
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Solution Overview
Problem
Existing radiographic imaging apparatuses with flexible substrates struggle to reduce thickness due to the lamination of sensor, signal processing, and driving ICs, limiting their thinness and flexibility.
Innovation Solution
The apparatus features a sensor substrate with pixels on a flexible base material, a conversion layer, and separate signal processing and driving substrates with cables that are strategically routed and connected to minimize overlap and thickness, allowing the sensor substrate to be thinner while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensor substrate, signal processing IC, and driving IC are laminated together, then the apparatus structure is more compact, but the thickness cannot be sufficiently reduced
Solution Approach 1:
The patent divides the apparatus into separate functional modules: sensor substrate, signal processing substrate, and driving substrate. These modules are connected via flexible substrates and cables rather than being tightly laminated, allowing each module to be optimized independently while reducing overall thickness.
Solution Approach 2:
The patent transitions from a three-dimensional lamination structure to a more distributed arrangement where substrates are connected via flexible cables that route signals through different spatial paths. This dimensional reorganization reduces the thickness direction occupation while maintaining functional integration.
2Weight of moving object
If a flexible base material is used for the sensor substrate, then the weight is reduced and imaging is easier, but the thickness reduction is limited due to lamination requirements
Solution Approach 1:
The patent employs flexible base materials for the sensor substrate and uses flexible substrates for signal processing and driving circuits. These flexible components are connected through flexible cables, creating a lightweight, thin-film-based architecture that maintains flexibility while minimizing thickness.
3Reliability
If cables are routed through the base material, then connection is achieved, but the structure becomes more complex and thickness is increased
Solution Approach 1:
The patent introduces flexible substrates and flexible cables as intermediary elements that connect the sensor substrate to the signal processing and driving substrates. These intermediaries route signals without requiring thick penetrations through the base material, maintaining thin profile while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a thinner radiographic imaging apparatus by optimizing cable routing and substrate placement, reducing thickness without compromising performance, and enhancing flexibility and image quality.
Implementation Method 1
a conversion layer, such as a scintillator, which converts radiation into light
Implementation Method 2
a sensor substrate in which a plurality of pixels, which accumulate electric charges generated in response to light converted in the conversion layer, are provided
Data Source
AI summary
A radiographic imaging apparatus including: a sensor substrate in which pixels are formed in a first surface of a base material; a conversion layer provided on the first surface; a signal processing substrate provided on one side the sensor substrate and includes at least a part of a signal processing unit; a driving substrate provided on the one side or the other side of the sensor substrate and includes at least a part of a drive unit; a first cable of which one end is connected to the sensor substrate and the other end is electrically connected to the signal processing substrate; and a second cable of which one end is connected to the sensor substrate, and passes through the first surface side or a second surface side of the base material and the other end is connected to the driving substrate.