Radiographic Sensor Noise Isolation via Segmented Circuit Mounting

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Solution Overview

Problem

Existing radiographic image detection devices suffer from electromagnetic noise propagation from circuit substrates to sensor panels, degrading the quality of radiographic images.

Innovation Solution

A radiographic image detection device with a conductive housing and a conductive substrate fixing portion that isolates specific circuit substrates from the sensor panel, using a higher impedance panel fixing portion to prevent noise propagation, and optionally featuring two sensor panels and circuit units for improved image quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If all circuit substrates are mounted and fixed to the rear surface of the base, then the device structure is simplified and ease of manufacture is improved, but electromagnetic noise is propagated from the circuit substrate to the sensor panel through the fixing portion, degrading radiographic image quality

Engineering Contradiction:
Improveease of manufactureVSAvoidelectromagnetic noise
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent segments the circuit substrates into two groups: specific substrates (e.g., analog signal processing circuits) are fixed to the housing, while other substrates (e.g., digital signal processing circuits) are fixed to the base. This spatial segmentation separates noise-sensitive circuits from noise-generating circuits, reducing electromagnetic interference to the sensor panel while maintaining manufacturing efficiency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces the housing as an intermediary structure between the circuit substrates and the sensor panel. By fixing specific circuit substrates to the housing rather than directly to the base, the housing acts as a mediator that isolates electromagnetic noise from the sensor panel, thereby protecting image quality while still allowing for efficient assembly.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If circuit substrates are fixed to the base, then device complexity is reduced, but electromagnetic noise propagates to the sensor panel degrading image quality

Engineering Contradiction:
Improvedevice complexityVSAvoidimage quality
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent divides the circuit substrate mounting locations into two distinct positions: those fixed to the housing and those fixed to the base. This segmentation allows noise-sensitive circuits to be physically separated from the sensor panel, reducing electromagnetic interference and improving image quality without significantly increasing device complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different fixing arrangements to different circuit substrates based on their noise characteristics. Specific substrates that generate or are sensitive to electromagnetic noise are fixed to the housing, while other substrates are fixed to the base. This localized differentiation optimizes image quality for noise-sensitive circuits while maintaining overall device simplicity.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the sensor panel is directly fixed to the housing, then assembly is simplified, but electromagnetic noise from circuit substrates propagates more easily to the sensor panel

Engineering Contradiction:
ImproveassemblyVSAvoidelectromagnetic noise propagation
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent extracts specific circuit substrates from the base-mounted configuration and relocates them to the housing. This extraction removes the noise propagation path from the base to the sensor panel, reducing electromagnetic interference while still allowing for relatively simple assembly through the housing's integration.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The housing serves as an intermediary structure that provides a mounting location for specific circuit substrates away from the sensor panel. This intermediary arrangement reduces direct electromagnetic coupling between the circuit substrates and sensor panel, lowering noise propagation while maintaining assembly efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces electromagnetic noise interference, maintaining high image quality and enhancing the reliability of index values derived from radiographic images, such as bone density calculations.

Implementation Method 1

a conductive substrate fixing portion that fixes a specific substrate which is at least one of the circuit substrates to the housing

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

pixels that accumulate charge in response to radiation, which has been emitted from a radiation source and transmitted through a subject

Methodology Applied
Scientific EffectCharge accumulation: Capacitance

Data Source

PatentUS10881366B2Radiographic image detection device
Publication Date: 2021.01.05 FUJIFILM CORP
  • US10881366B2 patent drawing
  • US10881366B2 patent drawing
  • US10881366B2 patent drawing

AI summary

A first sensor panel, a second sensor panel, a first circuit unit, and a second circuit unit are accommodated in a conductive housing of an electronic cassette. Of circuit substrates included in the first and second circuit units, a control substrate having a control circuit for controlling the operation of each of the first and second sensor panels is fixed to an inner surface of the housing through a metal spacer. The first and second sensor panels are attached to a front surface of a base. The base is fixed to the inner surface of the housing through a resin adhesive.