Radiographic Detection Substrate Masking Process Reduction

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Solution Overview

Problem

The manufacturing process of direct DR type X-ray radiography detectors is complex and costly due to the need for multiple masking processes in forming various electrodes and layers.

Innovation Solution

A radiographic detection substrate with a thin film transistor and signal storage unit is developed, where the first electrode is lapped with the drain electrode, and the second electrode is connected to the ground line through a via hole, reducing the number of masking processes and incorporating multiple layers into a single passivation layer, and a planarization layer is formed to simplify the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If multiple masking processes are used to form gate electrode, insulating layer, active layer, source electrode, ground line, drain electrode, first passivation layer, first electrode of storage capacitor, second passivation layer, second electrode of storage capacitor, planarization layer and electrode plate, then the structural complexity and functionality are achieved, but the manufacturing complexity and cost increase

Engineering Contradiction:
Improvestructural complexityVSAvoidmanufacturing complexity
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The patent merges multiple separate layers into a single integrated passivation layer. Specifically, the first passivation layer, second passivation layer, and planarization layer are combined into one passivation layer that contains embedded via holes. This consolidation reduces the number of masking processes from ten to twelve times to significantly fewer steps, directly resolving the contradiction between achieving complex structural functionality and maintaining ease of manufacture

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested structure where via holes are embedded within the passivation layer, and electrodes are positioned within these via holes. The first electrode of the storage capacitor is formed within a first via hole, and the second electrode is formed within a second via hole that extends through the passivation layer to the substrate. This nesting approach allows complex multi-layer functionality to be achieved through a simplified single-layer structure with embedded features

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If multiple masking processes are used to form various electrodes and layers, then the required electrical connections and signal storage functionality are achieved, but the manufacturing cost increases

Engineering Contradiction:
ImprovefunctionalityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple manufacturing steps into a single passivation layer formation process. Instead of separately forming first passivation layer, second passivation layer, and planarization layer with multiple masking steps, the invention forms one integrated passivation layer with embedded via holes in fewer steps, thereby reducing manufacturing cost while preserving all required electrical connections and signal storage functionality

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The via holes are pre-formed within the passivation layer during the same process step where the passivation layer is formed. This preliminary action of creating the via hole structure simultaneously with the passivation layer formation eliminates the need for subsequent separate via hole formation steps, reducing both manufacturing complexity and cost while ensuring proper electrical connections

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the manufacturing process and reduces costs by minimizing the number of masking processes required, while maintaining the functionality of the X-ray radiographic detection substrate.

Implementation Method 1

the amorphous silicon semiconductor layer 4 converts the photons of X-ray 9 passed through the electrode plate 2 and the insulating plate 3 into visible light, and converts the visible light into electrons

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Implementation Method 2

the scintillation crystal screen converts X-ray photons into visible light

Methodology Applied
Scientific EffectScintillation: Scintillation

Data Source

PatentUS10043846B2Radiographic detection substrate and manufacture method thereof, radiographic detection device
Publication Date: 2018.08.07 BOE TECHNOLOGY GROUP CO LTD
  • US10043846B2 patent drawing
  • US10043846B2 patent drawing
  • US10043846B2 patent drawing

AI summary

A radiographic detection substrate, a manufacture method thereof, and a radiographic detection device are provided. The radiographic detection substrate includes a substrate; and a thin film transistor and a signal storage unit which are formed on the substrate; the thin film transistor includes a gate electrode, an insulating layer, an active layer, a source electrode, a drain electrode and a passivation layer which are sequentially formed on the substrate; the signal storage unit includes a storage capacitor, the storage capacitor includes a first electrode and a second electrode, the first electrode is formed on the insulating layer and lapped with the drain electrode, the second electrode is connected to a ground line; the passivation layer is formed on the source electrode, the drain electrode, the first electrode and the ground line. The present invention efficiently decreases the number of masking processes by at least one connection method selected from lapping the first electrode and the drain electrode, connecting the second electrode to the ground line through the first via hole, and connecting the third electrode to the first electrode via the second via hole, to simplify the manufacture process of the radiographic detection substrate and reduce the manufacture costs.