Radome Airflow Path for Wireless Antenna Heat Dissipation
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Solution Overview
Problem
Wireless communication devices with multiple antennas face heat dissipation challenges, particularly when mounted on walls or columns, as the radiator fins are often obstructed, limiting airflow and reducing heat dissipation performance without increasing device size.
Innovation Solution
A wireless communication device design featuring a reflecting plate with a radome forming an airflow path, including an air inlet and outlet, and an array antenna with antenna elements aligned on the reflecting surface, facilitating convection and heat dissipation without enlarging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If radiator fins are attached to the rear face of the reflecting plate, then heat dissipation performance is improved, but when mounted on wall face or column, the radiator fins are covered and airflow is impeded, limiting heat dissipation performance
Solution Approach 1:
The airflow path is configured to extend in the thickness direction of the radome, creating a three-dimensional cooling channel that allows air to flow from the front surface through the interior to the rear surface. This dimensional approach enables heat dissipation functionality to be maintained regardless of mounting orientation, as the cooling path is established along the thickness axis rather than relying on externally attached fins that are sensitive to mounting position.
2Productivity
If the number of antennas and communication circuits is increased, then MIMO communication and beam forming capabilities are improved, but heat generation increases, requiring larger radiators and heat exchangers
Solution Approach 1:
The radome structure is merged with the heat dissipation function by configuring the interior space as an airflow path that directly contacts the antenna elements. The reflecting plate serves dual purposes as both the antenna mounting substrate and the rear boundary of the cooling channel. This integration eliminates the need for separate radiator components, achieving effective heat dissipation for high-power MIMO systems without increasing overall device volume.
Solution Approach 2:
The antenna elements themselves serve as heat dissipation surfaces by being directly exposed to the airflow path within the radome. The communication circuits utilize the same airflow channel for cooling, allowing the system components to self-cool through the integrated airflow path without requiring dedicated external cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation by allowing air to flow through the radome and contact the antenna elements, improving the cooling efficiency of the communication circuit while maintaining a compact device size.
Implementation Method 1
a radome covering the reflecting plate so as to form an airflow path between the radome and the reflecting surface
Implementation Method 2
a reflecting plate having a reflecting surface that reflects electromagnetic wave
Implementation Method 3
a communication circuit that transmits and receives a wireless signal by exciting the array antenna
Data Source
AI summary
A wireless communication device includes a reflecting plate having a reflecting surface that reflects electromagnetic wave, a radome covering the reflecting plate so as to form an airflow path between the radome and the reflecting surface, and including an air inlet and an air outlet communicating with the airflow path, an array antenna provided on the reflecting surface and inside the airflow path, and including a plurality of antenna elements aligned on the reflecting surface with an interval from each other, and a communication circuit that transmits and receives a wireless signal by exciting the array antenna. The plurality of antenna elements each include an antenna pattern formed on a plate-shaped dielectric substrate extending from the reflecting surface in a direction orthogonal thereto. Dissipation effect of heat from the communication circuit can be improved, by causing air convection in the airflow path in the radome.