Embedded Temperature Sensors for Radome Surface Measurement

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Solution Overview

Problem

Existing temperature sensors face challenges in measuring surface temperatures in environments with harsh conditions, such as radome surfaces with environmental coatings, where direct placement is impractical due to factors like radiation, extreme temperatures, and ice formation, which can hinder antenna operation.

Innovation Solution

A temperature sensing apparatus with two sensors disposed at differing depths from the surface and a measurement circuit that calculates the surface temperature using thermal resistance values and differential temperature measurements, allowing for indirect measurement without direct surface contact, protecting sensors from harsh conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature sensors are placed directly on the surface, then measurement precision is improved, but reliability deteriorates due to harsh environmental conditions

Engineering Contradiction:
Improvesurface temperature measurementVSAvoidsensor operation in harsh environment
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent introduces an intermediary calculation method that uses thermal resistance models as a mediator between the embedded sensors and the surface temperature measurement. Instead of direct contact, the system uses mathematical modeling of heat transfer through the radome material to infer surface temperature from sensor readings taken within the structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from a single-point surface measurement to a multi-depth embedded measurement approach. By placing sensors at different depths within the radome structure and using thermal conduction principles, the system solves for surface temperature through a dimensional transformation of the measurement problem.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If temperature sensors are embedded within the structure, then reliability is improved by protecting sensors from harsh conditions, but measurement precision deteriorates due to indirect measurement

Engineering Contradiction:
Improvesensor protection from harsh environmentVSAvoidsurface temperature measurement accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent uses thermal resistance calculations as an intermediary to bridge the gap between embedded sensor measurements and surface temperature. The system models heat transfer through the radome material properties to accurately infer surface conditions from internal sensor data, maintaining precision despite the protective embedding location.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system incorporates feedback through iterative calculation processes that adjust thermal resistance values based on measured temperature differentials between embedded sensors. This feedback mechanism refines the surface temperature calculation to achieve accurate results despite the indirect measurement approach.

Inventive Principle:
Principle #23Feedback

3Measurement precision

If multiple sensors are used at different depths, then measurement capability is improved for indirect surface temperature measurement, but device complexity increases

Engineering Contradiction:
Improvesurface temperature measurementVSAvoidsensor and measurement circuit configuration
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent designs the measurement system so that the same embedded sensors and measurement circuit perform multiple functions: measuring temperature at different depths, calculating thermal resistance values, determining heat flow rates, and inferring surface temperature. This multi-functionality reduces the need for separate dedicated components for each measurement task.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines multiple measurement and calculation functions into a single integrated measurement circuit system. Rather than having separate circuits for each sensor and each calculation type, the system merges these functions into one unified circuit that processes data from multiple sensors to produce comprehensive thermal analysis results.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate surface temperature measurement and heat flow calculation, preventing thermal runaway and effectively monitoring icing conditions, thus maintaining antenna performance despite harsh environmental factors.

Implementation Method 1

thermocouples or resistance temperature detectors (RTDs) that utilize known variations in thermal gradients

Methodology Applied
Scientific EffectThermal gradient: Temperature Gradient

Implementation Method 2

a measurement circuit that is coupled to the temperature sensors. The measurement circuit is operable to calculate the temperature of the surface based on a first temperature of one temperature sensor with a second temperature of the other temperature sensor

Methodology Applied
Scientific EffectThermal resistance: Conduction (thermal)

Data Source

PatentUS8280674B2Apparatus for measuring surface temperature using embedded components
Publication Date: 2012.10.02 RAYTHEON CO
  • US8280674B2 patent drawing
  • US8280674B2 patent drawing
  • US8280674B2 patent drawing

AI summary

In one embodiment, a temperature sensing apparatus includes two temperature sensors that are disposed at differing depths from a surface and a measurement circuit that is coupled to the temperature sensors. The measurement circuit is operable to calculate the temperature of the surface based on a first temperature of one temperature sensor with a second temperature of the other temperature sensor.