Rail Conveyor Board Movement Time Reduction
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Solution Overview
Problem
Existing electronic component mounting devices face challenges in reducing the movement time of circuit boards during the mounting process, particularly due to limitations in conveyor systems and solder application regions.
Innovation Solution
The introduction of a rail system with a conveyor in the component mounting region and the elimination of chains and belts allows for increased conveyor speed and a larger solder application area, enabling faster board movement and expanded component mounting capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a conveyor is introduced in the component mounting region with chains and belts, then board conveyance speed increases, but the movable region of the flow tank decreases
Solution Approach 1:
The patent divides the board conveyance system into two distinct regions: the component mounting region where boards are conveyed on rails without chains or belts, and the region in front of it where a conveyor with chains and belts is introduced. This segmentation allows each region to have optimized characteristics - the rail region provides unrestricted flow tank movement while the conveyor region enables high-speed conveyance.
Solution Approach 2:
Different conveyance methods are applied to different spatial locations. The component mounting region uses a simple rail structure that allows maximum freedom of movement for the flow tank, while the region in front uses a high-speed conveyor system. This local differentiation resolves the contradiction by assigning appropriate qualities to each region based on its functional requirements.
2Productivity
If chains and belts are provided in the component mounting region, then board conveyance speed increases, but the solder applying region and component mountable region become smaller
Solution Approach 1:
The patent segments the working area into a component mounting region with rails only (providing large solder applying region) and a conveyance region with conveyor (providing high speed). This allows both high productivity and large working area to be achieved in different zones.
Solution Approach 2:
The patent resolves the spatial conflict by introducing a temporal dimension - high-speed conveyance occurs in front of the mounting region during board positioning, while the actual soldering and component mounting operations occur in the rail region where boards move slowly or are stationary, allowing both speed and area requirements to be satisfied.
Data Source
AI summary
The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.