Rail Vehicle Electronic Cooling via Segmented Air Guide

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Solution Overview

Problem

Hot spots in electronic components can be difficult to predict and access, leading to potential damage from exceeded temperature limits, especially in compact designs where conventional cooling methods are hindered by component positioning.

Innovation Solution

An electronic arrangement featuring an air guiding body and a fan that supplies cooling air to the component through strategically positioned air outlets, often within a closed housing, utilizing a heat exchanger for enhanced cooling and an electrically insulating material to prevent electrical issues, allowing for targeted and reliable cooling of components inaccessible for direct fan mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling methods are used with direct fan mounting, then cooling effectiveness is improved for accessible components, but cooling capability is lost for inaccessible hot spots in compact designs

Engineering Contradiction:
Improvecomponent temperatureVSAvoidaccessibility for direct cooling
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The cooling system is segmented into a fan unit and a separate air guide body with multiple air outlets. The air guide body is divided into multiple regions with air outlets positioned at different locations to target specific hot spots. This segmentation allows cooling air to be delivered to inaccessible areas without requiring direct fan mounting near each component.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The air guide body serves as an intermediary between the fan and the electronic components. It receives cooling air from the fan and redistributes it through multiple air outlets to reach hot spots that would be inaccessible to direct fan mounting. The air guide body mediates the cooling function, enabling thermal management of inaccessible components.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the air guide body is made of electrically conductive material, then structural strength is improved, but electrical short circuit risk increases in high-voltage environments

Engineering Contradiction:
Improveair guide body strengthVSAvoidelectrical short circuit risk
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The air guide body is made of an electrically insulating material that also provides the necessary structural strength. This composite material approach resolves the contradiction by selecting a material that simultaneously satisfies both mechanical strength requirements and electrical insulation requirements for high-voltage environments.

Inventive Principle:
Principle #40Composite materials

3Temperature

If additional heat exchangers are added to enhance cooling, then cooling performance is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improvecooling performanceVSAvoidnumber of heat exchangers
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The air guide body serves multiple functions: it distributes cooling air to multiple hot spots, provides structural support, and acts as an electrical insulator. By making the air guide body multi-functional, the patent avoids adding separate heat exchangers, thereby maintaining simplicity while achieving enhanced cooling performance.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Temperature

If the housing is opened for air exchange with external environment, then cooling efficiency is improved, but protection against dusty conditions is reduced

Engineering Contradiction:
Improvecooling efficiencyVSAvoiddust exposure
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The housing maintains a closed environment that protects electronic components from dusty external conditions. The air guide body redirects cooling air from within the closed housing to inaccessible hot spots, enabling effective cooling without requiring openings in the housing that would expose components to dust and other harmful environmental factors.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively minimizes the risk of damage to electronic components by providing targeted cooling, maintaining component reliability even in high-voltage environments and dusty conditions, without requiring architectural revisions or additional heat exchangers, and is particularly suitable for rail vehicles.

Implementation Method 1

a fan (4), wherein the fan (4) supplies the air guide body (3) with cooling air during operation of the electronic arrangement (1)

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

an air guide body (3) having at least one air outlet (31) through which the air guide body (3) cools the electronic component (2) with the cooling air

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

utilizing a heat exchanger for enhanced cooling

Methodology Applied
Scientific EffectHeat Exchanger: Heat Exchanger

Data Source

PatentEP3755132A1Electronic device, method of manufacturing the same, and railway vehicle
Publication Date: 2020.12.23 SIEMENS MOBILITY GMBH
  • EP3755132A1 patent drawingFigure 1~3
  • EP3755132A1 patent drawingFigure 4~6
  • EP3755132A1 patent drawingFigure 7~9

AI summary

An electronic arrangement (1) is described, comprising at least one electronic component (2), an air guide (3), and a fan (4) that supplies the air guide with cooling air during operation of the electronic arrangement. The air guide has at least one air outlet (31) through which the air guide cools the electronic component with the cooling air. A rail vehicle (9) and a method for manufacturing an electronic arrangement are also described.