Raised Adhesive Layer for Single-Step Micro LED Transfer
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Solution Overview
Problem
The transfer process of micro LED chips using conventional surface mount systems is time-consuming and can damage both the micro LED chips and the permanent substrate due to pressure and thermal changes, leading to inefficient bonding and potential substrate damage.
Innovation Solution
A light emitting assembly is designed with a substrate and an adhesive layer, where micro LED units are attached in a patterned manner to facilitate direct bonding to a circuit board in a single transferring step, minimizing damage and improving bonding strength through the use of a substrate that can withstand high temperatures and an adhesive layer with adjustable hardness and protrusions for efficient release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional surface mount system is used for transferring micro LED chips, then the transfer process can be automated, but the transfer time becomes excessively long and bonding strength is reduced due to pressure and thermal changes
Solution Approach 1:
The invention segments the transfer process into two distinct stages: first, attaching micro LED chips to a temporary substrate in batch mode using a pick-and-place system; second, transferring the entire array of chips from the temporary substrate to the permanent substrate in a single operation. This segmentation allows automated batch attachment while enabling rapid final transfer, resolving the contradiction between automation and transfer speed.
Solution Approach 2:
The invention introduces a temporary substrate as an intermediary carrier between the pick-and-place system and the permanent substrate. This temporary substrate serves as a buffer that allows batch attachment of micro LED chips without subjecting them to repeated pressure and thermal cycles, thereby maintaining bonding strength while enabling efficient batch processing.
2Ease of manufacture
If repeated pick-and-place procedure is used, then micro LED chips can be transferred to permanent substrate, but bonding strength is adversely affected and substrate may be damaged
Solution Approach 1:
The transfer process is segmented into batch attachment to temporary substrate followed by single-step transfer to permanent substrate. This eliminates repeated pick-and-place operations on the final bonding interface, preserving bonding strength while maintaining manufacturing capability.
Solution Approach 2:
The micro LED chips are preliminarily attached to the temporary substrate in batch mode before final transfer. This preliminary action allows the permanent substrate bonding interface to be established only once, preventing repeated thermal and mechanical stress that would compromise bonding strength.
3Ease of manufacture
If conventional transfer process is used, then micro LED chips can be mounted on circuit board, but transfer time becomes excessively long
Solution Approach 1:
The invention merges multiple micro LED chip attachments into a single transfer operation. By attaching chips to a temporary substrate in batch and then transferring the entire array in one step, the total transfer time is dramatically reduced compared to conventional sequential mounting, while maintaining full mounting capability.
Solution Approach 2:
The preliminary batch attachment to temporary substrate enables subsequent single-step transfer to permanent substrate. This preliminary organization of chips allows rapid final mounting, reducing total transfer time while preserving complete mounting functionality.
Data Source
AI summary
A light emitting assembly includes a substrate, an adhesive layer on the substrate, and a plurality of light emitting units on the adhesive layer. Each of the light emitting units includes a first-type semiconductor layer, a second-type semiconductor layer, an active layer disposed between the first-type and second-type semiconductor layers, a first electrode electrically connected to the first-type semiconductor layer, and a second electrode electrically connected to the second-type semiconductor layer. A light emitting apparatus including the light emitting assembly is provided. Methods for making the light emitting assembly and the light emitting apparatus are provided.