Raised Antenna Via Structure for Electromagnetic Decoupling
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Solution Overview
Problem
Miniature antennas for portable electronic devices face challenges in maintaining efficiency and compactness while covering wide frequency bands, leading to issues such as increased electrical resistance and design constraints due to their electrical connection with microelectronic circuits and the need for multiple antennas causing electromagnetic coupling.
Innovation Solution
The use of electrically conductive vias to raise antennas relative to the microelectronic circuit, allowing for a more compact design and improved mechanical support, while also incorporating an electromagnetic decoupling module to reduce coupling between antennas, utilizing techniques like the Bond Via Array (BVA) method for manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If antennas are miniaturized to adapt to dimensional constraints, then device compactness is improved, but antenna efficiency deteriorates due to increased electrical resistance
Solution Approach 1:
The patent raises the antenna structure vertically above the microelectronic circuit using support pillars, transitioning from a planar to a three-dimensional configuration. This allows the antenna to achieve effective radiating dimensions while maintaining a compact footprint on the circuit board, thereby improving efficiency without sacrificing compactness.
Solution Approach 2:
The patent introduces electrically conductive vias as intermediary elements to create low-resistance electrical connections between the raised antenna and the microelectronic circuit. These vias distribute the electrical connection over multiple smaller contact points, reducing overall electrical resistance and minimizing energy loss in the connection path.
2Adaptability or versatility
If multiple antennas are installed to cover different frequency standards, then frequency coverage is improved, but electromagnetic coupling between antennas increases
Solution Approach 1:
By raising antennas vertically above the circuit plane on isolated support pillars, the patent creates spatial separation between multiple antennas. This three-dimensional arrangement reduces electromagnetic coupling by increasing the distance between antenna elements and providing electromagnetic isolation, allowing multiple frequency standards to operate simultaneously without interference.
3Volume of moving object
If antennas are raised relative to the microelectronic circuit to improve compactness, then device thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent divides the antenna structure into separate functional components: support pillars for mechanical elevation, electrically conductive vias for electrical connection, and the radiating antenna element itself. This segmentation allows each component to be manufactured and optimized independently using standard semiconductor fabrication techniques, reducing overall manufacturing complexity despite the three-dimensional configuration.
4Loss of energy
If electrically conductive vias are used to connect raised antennas, then electrical resistance is reduced, but substrate area occupation increases
Solution Approach 1:
The patent distributes the electrical connection through multiple discrete vias rather than using large continuous conductors. These vias are positioned at the periphery of the antenna structure, utilizing otherwise wasted substrate space. This segmentation approach reduces electrical resistance through parallel conduction paths while minimizing the footprint on the substrate.
Data Source
Figure 1~2a
Figure 2b~3a
Figure 3b~3c
AI summary
The present invention relates to a method for manufacturing a radio frequency signal transmission and/or reception device (1) comprising at least one microelectronic circuit (2) comprising at least one first antenna comprising at least one first electrically conductive surface comprising at least the following steps: • Formation of at least one first connecting element of the first antenna (10) comprising the formation of a first plurality of electrically conductive vias (12); • Overmolding of at least the first area of the microelectronic circuit (2) so as to partially cover at least said first connecting element and so as to define a first surface; • Formation of the first electrically conductive surface (11) of the first antenna (10) at the level of said first surface in electrical continuity with at least a part of said first plurality of electrically conductive vias.