Raised Contact Formation for Fluid Die Miniaturization
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Solution Overview
Problem
Existing fluid devices face challenges in minimizing the size of the fluid die while maintaining electrical connections, as the size of the electrical contact pad and clearance around it are compromised by the molded panel, which interferes with conductive members.
Innovation Solution
A fluid device design where a raised contact formation on the substrate extends up to the top surface of the molded panel to form electrical connections with components above the panel, reducing the surface area required for electrical connections and allowing for a smaller fluid die size, with the raised contact formation being embedded in the molded panel to avoid interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a conventional electrical contact pad design is used on the substrate, then electrical connections can be established, but the surface area required for the contact pad and its clearance increases the fluid die size
Solution Approach 1:
The contact formation is extended from the substrate plane into the molded panel volume, creating a three-dimensional structure that projects upward. This dimensional transition allows the electrical connection interface to occupy vertical space rather than solely horizontal space, thereby reducing the surface area footprint on the substrate while maintaining adequate clearance and connection reliability.
Solution Approach 2:
The contact formation is embedded within the molded panel structure, with the conductive path nested inside the panel material. This nesting approach allows the electrical connection to be integrated within the molded panel volume rather than requiring external clearance space, effectively reducing the overall footprint while maintaining reliable electrical coupling between the substrate and upper components.
2Volume of moving object
If the molded panel is positioned close to the substrate, then the fluid die size is reduced, but the molded panel interferes with conductive members connecting to the electrical contact pad
Solution Approach 1:
The contact formation projects upward from the substrate through the molded panel, creating a vertical interface that extends into the third dimension. This allows conductive members to connect to the contact formation from above the molded panel surface, eliminating interference between the panel and connection operations while maintaining compact fluid die volume.
Solution Approach 2:
The contact formation acts as an intermediary structure that bridges the substrate and the space above the molded panel. By providing this intermediate connection point that extends through the panel, the design enables conductive members to connect without being blocked by the panel, thus facilitating ease of operation while maintaining compact dimensions.
Data Source
AI summary
Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.