Raised ELG Conductive Structures for Probe Stability

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Solution Overview

Problem

In the lapping process of magnetic head manufacturing, the planar surface of electrical lapping guide (ELG) pads leads to unstable contact between the probe and the pads, resulting in inaccurate or failed resistance measurements due to shifting during the process.

Innovation Solution

The integration of conductive structures around the ELG pads, which are higher than the surface, prevents the probe from shifting and ensures stable contact, allowing for efficient and accurate resistance measurements by forming a limiting perimeter around the first and second ELG pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If ELG pads have planar surface, then manufacturing is simple, but probe contact stability deteriorates during lapping process

Engineering Contradiction:
ImproveELG pad manufacturing simplicityVSAvoidprobe contact stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention transitions the ELG pad from a two-dimensional planar surface to a three-dimensional structure by adding raised conductive patterns on the pad surface. This dimensional change creates physical boundaries that prevent probe shifting while maintaining manufacturing feasibility through standard photolithography and deposition processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive patterns are strategically positioned at specific locations on the ELG pad surface to create localized contact regions. These localized high-conductivity areas provide stable probe contact points without requiring the entire pad surface to be complex, thus balancing manufacturing simplicity with contact reliability.

Inventive Principle:
Principle #3Local quality

2Device complexity

If ELG pads have planar surface, then device complexity is low, but measurement precision deteriorates due to probe shifting

Engineering Contradiction:
ImproveELG pad structure complexityVSAvoidresistance measurement accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

By adding vertical height variation through raised conductive patterns on the ELG pad surface, the invention creates defined contact zones that prevent lateral probe movement. This dimensional enhancement improves measurement precision without significantly increasing overall device complexity, as the patterns are formed using standard fabrication processes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive patterns create localized high-quality contact regions with defined geometry, ensuring consistent probe positioning and contact pressure. This local enhancement of contact quality improves measurement precision while keeping the overall pad structure relatively simple and compatible with existing manufacturing workflows.

Inventive Principle:
Principle #3Local quality

3Area of stationary object

If probe contacts planar ELG pad surface, then contact area is large, but contact stability deteriorates due to probe shifting

Engineering Contradiction:
ImproveELG pad contact areaVSAvoidcontact stability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The conductive patterns concentrate the contact area into specific localized regions with defined geometry rather than distributing contact over the entire pad surface. This creates stable, reproducible contact points that prevent probe shifting while maintaining sufficient contact area for reliable electrical connection.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

By creating raised conductive patterns with vertical height, the invention transforms the contact interface from a purely two-dimensional planar contact to a three-dimensional structured contact. This provides mechanical engagement features that prevent lateral probe movement while maintaining adequate contact area through the patterned conductive regions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10490212B2Row bar and wafer for forming magnetic heads
Publication Date: 2019.11.26 SAE MAGNETICS (HK) LTD
  • US10490212B2 patent drawing
  • US10490212B2 patent drawing
  • US10490212B2 patent drawing

AI summary

A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.