Raised Lead Interconnection Adhesion Control
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Solution Overview
Problem
Existing methods for interconnecting electronic devices are complex and often require sacrificial layers, leading to manufacturing challenges and difficulties in achieving an acceptable level of quality, particularly due to issues with adhesion and accuracy in forming leads.
Innovation Solution
A process involving the formation of adhesion promoting regions of porous silicon on a substrate, with controlled porosity, to enhance lead adhesion and facilitate the raising of leads between substrates, eliminating the need for sacrificial layers and improving manufacturing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sacrificial layers are used to facilitate lead raising, then lead adhesion control is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent removes the sacrificial layer from the manufacturing process entirely. Instead of using a sacrificial layer that must be deposited, patterned, and later removed, the invention directly forms leads with controlled adhesion to the substrate through selective etching and metal deposition, eliminating the intermediate sacrificial layer step and reducing process complexity
Solution Approach 2:
The patent introduces an adhesion promoter layer as an intermediary between the substrate and the lead metal. This thin layer (such as chromium or titanium) provides controlled adhesion without requiring a thick sacrificial layer, enabling precise lead positioning and raising while simplifying the overall manufacturing process
2Adaptability or versatility
If leads are raised between substrates, then interconnection flexibility is improved, but adhesion control and manufacturing accuracy deteriorate
Solution Approach 1:
The patent performs preliminary actions by forming the lead structure with controlled adhesion zones before the substrates are fully assembled. The leads are partially formed and positioned on the substrate, with specific sections having controlled adhesion strength, allowing them to be raised and bent into position while maintaining precise alignment and connection points
Solution Approach 2:
The patent applies different adhesion characteristics to different portions of the lead structure. The base portion of each lead has strong adhesion to the substrate for stable positioning, while the raised portion has reduced adhesion to allow flexibility and bending. This local differentiation of adhesion quality enables both precision positioning and interconnection flexibility
3Reliability
If adhesion of leads to substrate is increased, then lead stability is improved, but lead raising and detachment becomes difficult
Solution Approach 1:
The patent creates zones of different adhesion strength along the lead structure. The anchor portion at the substrate interface has high adhesion (through adhesion promoters) for stability, while the free portion has low adhesion to facilitate easy raising and detachment. This local quality differentiation resolves the contradiction between stability and ease of manipulation
Solution Approach 2:
The patent applies adhesion promotion only partially - specifically at the base of the leads where stability is needed, rather than uniformly across the entire lead structure. This partial application of adhesion enhancement maintains lead stability at the substrate interface while leaving the upper portions easily raiseable and detachable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for high-density, long leads with improved adhesion and quality, reducing complexity and enhancing the reliability of interconnection elements, enabling efficient manufacturing of interconnection elements and electronic assemblies.
Implementation Method 1
forming a plurality of regions of porous silicon (120) on a front surface (110) of a lower substrate (105)
Data Source
AI summary
An embodiment of a process of manufacturing an interconnection element for contacting electronic devices is proposed. The process starts with the step of forming a plurality of leads on a main surface of a first substrate; each lead has a first end and a second end. The second end of each lead is coupled with a second substrate. The second substrate and the first substrate are then spaced apart, so as to extend the leads between the first substrate and the second substrate. The process also includes the step of treating the main surface before forming the leads to control an adhesion of the leads on the main surface.