Raised Surface Power Corridors for Low-Layer Package Substrates
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Solution Overview
Problem
The reduction in size of mobile electronic devices requires smaller system-in-package components, specifically reducing the Z-height of semiconductor packages, while existing technologies face challenges in minimizing package layer counts without compromising power delivery performance.
Innovation Solution
The implementation of raised electrical conductors, or power corridors, on the surface of the package substrate replaces internal power planes, using metal deposition techniques to enhance power delivery and reduce the equivalent series resistance (ESR) by routing power delivery externally, thereby minimizing the number of layers needed within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If internal power planes are used within the package substrate, then power delivery performance is maintained, but the number of layers increases and Z-height increases
Solution Approach 1:
The patent transitions power delivery from internal substrate layers to the external surface dimension by forming raised electrical conductors on the package substrate surface. This dimensional shift eliminates the need for dedicated internal power planes while maintaining power delivery capability, thereby reducing layer count without sacrificing performance
Solution Approach 2:
The invention extracts the power delivery function from the internal substrate structure and relocates it to the external surface through raised conductors. This separation allows the substrate internal layers to be reduced or eliminated while power delivery continues through the external conductor network
2Reliability
If internal power planes are used within the package substrate, then power delivery performance is maintained, but Z-height increases
Solution Approach 1:
By moving power delivery to the external surface dimension rather than consuming internal Z-space for power planes, the patent achieves reduced Z-height while maintaining power delivery through the raised conductor configuration
3Ease of manufacture
If the number of layers is reduced, then costs decrease and supply-chain constraints are addressed, but power delivery performance may deteriorate
Solution Approach 1:
The patent changes the physical parameters of the conductors by raising them from the substrate surface, creating three-dimensional power corridors with optimized cross-sectional area and path. This parameter change enables reduced layer count while maintaining low ESR and effective power delivery
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces package layer counts, decreases costs, and addresses supply-chain constraints by improving power delivery performance while maintaining or enhancing the load line, thus achieving a smaller Z-height without deteriorating power delivery.
Implementation Method 1
using metal deposition techniques to enhance power delivery and reduce the equivalent series resistance (ESR)
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, techniques, or processes directed to an electrical conductor, or power corridor, on the outside of a package substrate, wherein the electrical conductor is raised, or extends from a surface of the package substrate. In embodiments, this electrical conductor may be used to reduce the number of layers required within the package substrate by removing power planes within the substrate to the electrical conductors on the surface of the package. Other embodiments may be described and/or claimed.