Raised Region Test Board for Memory Signal Testing
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Solution Overview
Problem
Existing test boards for memory signals face challenges in avoiding physical interference with peripheral devices on the main board and in simplifying the circuit structure due to the need for RC matching circuits to reduce signal interference.
Innovation Solution
A test board design with a first surface featuring a raised region and a non-raised region, and a second surface with a test area and a connection area, utilizing connection harnesses to connect the test area to both surfaces, allowing for memory signal testing without physical interference and without the need for RC matching circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the size of the test board is limited to match the mounting position of the memory chip on the main board, then physical interference with peripheral devices is avoided, but the area available for testing is reduced
Solution Approach 1:
The patent introduces a height dimension by creating a raised region on the test board. The first connection area is positioned in a raised region where the level is higher than the non-raised region by a preset value (e.g., 0.5-2mm). This vertical elevation allows the connection area to extend beyond the footprint of the memory chip mounting position without causing physical interference with peripheral devices on the main board, thus resolving the contradiction between avoiding interference and maintaining sufficient test area.
2Reliability
If RC matching circuits are added to reduce signal interference from test leads, then signal quality is improved, but the circuit board structure becomes complicated
Solution Approach 1:
The patent extracts and removes the RC matching circuits from the test board design. Instead of using RC matching circuits to compensate for signal interference, the invention achieves signal integrity through optimized signal path design and direct connection methods, thereby eliminating the need for additional matching components and simplifying the overall circuit board structure while maintaining signal quality.
3Ease of operation
If leads are used to connect the test board to the memory chip, then flexibility is improved, but signal interference increases requiring RC matching circuits
Solution Approach 1:
The patent replaces the traditional mechanical lead-based connection system with a direct integrated circuit board connection system. The test board includes a second connection area that directly connects to the memory chip, eliminating the need for external leads. This substitution removes the signal interference problem caused by leads while maintaining connection flexibility through the integrated design, thus resolving the contradiction between flexibility and signal interference.
Data Source
AI summary
A test board for testing a memory signal includes a first surface and a second surface. The first surface of the test board comprises a raised region and a non-raised region. The raised region is provided with a first connection area connectable to a main board, and a level at which the raised is located is higher than a level at which the non raised region is located by a preset value. The second surface of the test board includes a test area and a second connection area connectable to a memory chip. The test board is provided with a first connection harness for connecting the test area to the first connection area and a second connection harness for connecting the test area to the second connection area, to enable the memory signal of the memory chip to be tested based on the test area.