High-Frequency Module Structure Using Raised Substrate Isolation
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Solution Overview
Problem
In high-frequency modules, the miniaturization and high integration demanded by mobile communication devices are hindered by reduced isolation between acoustic wave filters and power amplifier circuit elements when they are mounted adjacent to each other on the same substrate, leading to signal interference.
Innovation Solution
The implementation of a substrate with protruding portions that separate electronic components in the height direction, using columnar electrodes and ceramic portions to reduce signal interference, and configuring the module to minimize the height and maximize integration, with the power amplifier circuit element mounted on the substrate outer peripheral portion and the acoustic wave device on a protruding portion, and the semiconductor circuit device mounted on the protruding portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the acoustic wave filter and power amplifier circuit element are mounted adjacent to each other on the same plane of the substrate, then the device achieves miniaturization and high integration, but the isolation between components is reduced leading to signal interference
Solution Approach 1:
The patent introduces a protruding portion that extends in the thickness direction (Z-axis) from the substrate main surface. By mounting the acoustic wave device on this protruding portion and the power amplifier circuit element on the substrate main surface, the components are separated in the height direction, transforming a two-dimensional layout problem into a three-dimensional spatial solution that reduces signal interference while maintaining compact footprint.
2Object-affected harmful factors
If the protruding portion height is increased to improve isolation, then signal interference is reduced, but the overall module height increases
Solution Approach 1:
The protruding portion is positioned locally at a specific region of the substrate rather than uniformly increasing the entire substrate height. This localized elevation provides the necessary isolation distance for signal interference reduction only where the acoustic wave device is mounted, while the rest of the module maintains a compact height profile.
Data Source
AI summary
A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).