Raised-Periphery Susceptor for Flat (110) Epitaxial Wafers

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Solution Overview

Problem

Existing susceptors for epitaxial growth struggle to produce highly flat (110) epitaxial wafers due to differences in crystal orientation, leading to uneven growth speeds and negative shifts in flatness indices like Front ZDD, especially when used with (100) wafers.

Innovation Solution

A susceptor design with a pocket and outer periphery featuring a raised portion adjacent to the pocket, where the wafer surface is positioned above the flat portion, and optionally with a depressed portion, to manage growth speeds and maintain flatness, specifically for (110) wafers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a susceptor designed for (100) wafers is used for (110) wafers, then the basic epitaxial growth function is maintained, but the flatness indices (ESFOR MAX and Front ZDD) deteriorate due to different crystal orientation growth characteristics

Engineering Contradiction:
Improvesusceptor compatibilityVSAvoidwafer flatness
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The susceptor outer periphery is divided into different regions with distinct functions: a flat portion and a raised portion. The raised portion is specifically positioned to correspond to the high growth speed region on the (110) wafer surface, providing localized control over the epitaxial growth process to achieve uniform flatness across the wafer.

Inventive Principle:
Principle #3Local quality

2Ease of operation

If the side wall is raised to contain the wafer, then wafer positioning is improved, but process gas supply to the outer periphery is inhibited, causing epi-film thickness to decrease and Front ZDD to shift negatively

Engineering Contradiction:
Improvewafer positioningVSAvoidFront ZDD flatness
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The outer periphery is segmented into a flat portion and a raised portion with different heights. The raised portion is strategically positioned to provide mechanical support and positioning without completely blocking gas flow, while the flat portion allows adequate process gas supply to maintain epi-film thickness and positive Front ZDD values.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The susceptor outer periphery features an asymmetric structure with a raised portion that is not uniformly distributed but specifically positioned to match the anisotropic growth characteristics of (110) wafers, creating non-uniform height distribution to optimize both positioning and gas flow.

Inventive Principle:
Principle #4Asymmetry

3Reliability

If the pocket depth is increased to fully contain the wafer, then wafer stability is improved, but the height relationship between wafer and susceptor surface changes, affecting gas flow distribution and growth uniformity

Engineering Contradiction:
Improvewafer stabilityVSAvoidgrowth uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The pocket depth is optimized to a specific parameter range where the wafer upper face position relative to the flat portion upper face is controlled within 0.05-0.35mm. This parameter optimization ensures both wafer stability during processing and appropriate gas flow distribution for uniform epitaxial growth across the wafer surface.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The susceptor enables the production of highly flat (110) epitaxial wafers by controlling growth speed and reducing negative shifts in flatness indices, achieving improved ESFOR MAX and positive shifts in Front ZDD.

Implementation Method 1

performing vapor-phase growth

Methodology Applied
Scientific EffectVapor-phase deposition: Physical Vapour Deposition

Implementation Method 2

susceptor for epitaxial growth on a wafer having a main surface of a (110) plane

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Data Source

PatentUS20260090332A1Susceptor for epitaxial growth and method for producing epitaxial wafer
Publication Date: 2026.03.26 SHIN ETSU HANDOTAI CO LTD
  • US20260090332A1 patent drawing
  • US20260090332A1 patent drawing
  • US20260090332A1 patent drawing

AI summary

The present invention is a susceptor for epitaxial growth on a wafer having a main surface of a (110) plane, the susceptor for epitaxial growth including: a pocket for mounting a wafer; and an outer periphery surrounding the pocket, wherein the outer periphery is provided with a flat portion and a raised portion that is a portion adjacent to the pocket and that has a portion projected from an upper face of the flat portion, and the pocket is designed such that, when the wafer is mounted on the pocket, a height of an upper face of the wafer is positioned above a height of the upper face of the flat portion. This provides a susceptor for epitaxial growth that can produce a highly flat (110) epitaxial wafer by using a wafer (a substrate) having a main surface of (110).