Thermal Management Assembly for RAM Modules
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Solution Overview
Problem
High device temperatures in RAM modules, such as DIMMs, can reduce their operational life and functionality due to heat generated during operation.
Innovation Solution
A thermal management assembly comprising a first and second thermal management member, along with a connection member, is coupled to the RAM module to absorb and dissipate heat, utilizing continuous and discontinuous regions for alignment and connection, and potentially incorporating materials like aluminum alloy or copper, to maintain device temperature within safe limits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal management members are added to RAM modules to dissipate heat, then device temperature is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple thermal management members (first and second thermal management members with continuous and discontinuous regions) into a single integrated assembly that couples to the RAM module. This merging approach provides comprehensive heat dissipation across different areas while maintaining a unified structure, thereby reducing device temperature without proportionally increasing complexity.
Solution Approach 2:
The thermal management assembly is segmented into distinct functional regions: a first thermal management member with a continuous region for uniform heat distribution, and a second thermal management member with a discontinuous region featuring openings for targeted heat dissipation. This segmentation allows each region to address specific thermal challenges, improving overall heat management efficiency while keeping the structure organized and manageable.
2Duration of action of stationary object
If thermal management assembly is coupled to RAM module, then operational life is extended, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different structural qualities to different parts of the thermal management assembly. The first thermal management member has a continuous region for broad thermal coverage, while the second member has a discontinuous region with openings for specific heat venting. This local differentiation allows each region to be optimized for its specific function, improving overall effectiveness without requiring uniform high precision across the entire assembly.
Solution Approach 2:
The thermal management assembly serves multiple functions simultaneously: the continuous region provides broad thermal conduction, the discontinuous region enables targeted heat dissipation through openings, and the connection member integrates both regions into a unified coupling system. This multi-functionality extends operational life by addressing various thermal management needs within a single assembly, reducing the need for multiple separate components and their associated precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal management assembly effectively reduces the device temperature of RAM modules, thereby extending their operational life and maintaining functionality by efficiently dissipating heat without increasing the overall height of the module.
Implementation Method 1
The first thermal management member may include a first main region that is continuous and a first connection region that is discontinuous. The second thermal management member may include a second main region and a second connection region.
Data Source
AI summary
A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.