Random Conductor Track Cover for PCB Manipulation Detection
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Solution Overview
Problem
Existing protective arrangements for circuit boards are complex to manufacture, lack reproducibility, and cannot fully enclose the object to be protected without gaps, with high manufacturing costs and susceptibility to reverse engineering.
Innovation Solution
A protective arrangement featuring a plastic cover with randomly arranged conductor tracks activated by laser and metallized, connected to an evaluation unit for detecting manipulation, which is produced using injection molding and automated processes to ensure uniqueness and cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If foils with casting resin are used to protect the module, then the module is enclosed, but the production is complex and quality cannot be reliably reproduced
Solution Approach 1:
The patent changes the physical and chemical parameters of the protective layer by using a thermoplastic material that can be molded in different states (molten and solidified). This allows automated injection molding processes to create consistent, gap-free enclosures with reproducible electrical properties, eliminating the hand-casting complexity while maintaining reliability.
Solution Approach 2:
The patent replaces the manual mechanical casting process with an automated injection molding system. The thermoplastic material is injected under controlled pressure and temperature, then solidified to form the protective layer. This substitution of mechanical processes with automated systems ensures consistent quality and eliminates the reproducibility issues of manual casting.
2Reliability
If printed circuit board material hoods are used to enclose the module, then the object is protected, but the manufacturing is complicated and costs are high
Solution Approach 1:
The patent changes the material parameter from rigid printed circuit board material to a thermoplastic that can be easily molded. This allows the protective layer to be formed through simple injection molding processes rather than complex milling and soldering operations, significantly simplifying manufacturing while maintaining protection effectiveness.
Solution Approach 2:
The patent employs a cost-effective thermoplastic material that can be mass-produced through injection molding. This replaces the expensive printed circuit board material and complex assembly processes with a simpler, more economical solution that achieves the same protective function at lower cost.
3Ease of manufacture
If standard conductor track arrangements are used, then the production is simple, but the security is vulnerable to reverse engineering
Solution Approach 1:
The patent introduces asymmetry and randomness into the conductor track arrangement within the protective layer. Instead of standard symmetric patterns, the conductor tracks are positioned randomly or asymmetrically, making each protective arrangement unique and difficult to reverse engineer. This maintains production simplicity while significantly enhancing security.
4Reliability
If the protective layer completely encloses the module, then security is improved, but process openings are required for casting compound introduction
Solution Approach 1:
The patent performs preliminary action by injecting the thermoplastic material before final solidification. The material is injected in a molten state that allows it to flow and fill all cavities completely, then solidifies to create a gap-free enclosure. This eliminates the need for process openings that would be required in post-enclosure filling methods.
Solution Approach 2:
The patent utilizes parameter changes in the thermoplastic material's physical state. The material is injected in a molten, flowable state that enables complete enclosure formation, then solidifies to create the final protective structure. This phase change allows complete enclosure without requiring openings for material introduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective, reproducible, and gap-free protective arrangement with unique mechanical and electrical properties, capable of detecting manipulation without damaging the conductor tracks, thus enhancing security and reducing manufacturing complexity.
Implementation Method 1
the conductor tracks consist of the additives activated by means of a laser and then metallized
Implementation Method 2
the conductor tracks consist of the additives activated by means of a laser and then metallized
Data Source
Figure 1a~1b
Figure 2~3
AI summary
The present invention relates to a protective arrangement (1), comprising a printed circuit board (2), a cover (8) disposed at least on one side of the printed circuit board (2), wherein the cover (8) has randomly disposed conductive tracks (6), and an evaluation unit (3). The evaluation unit (3) is connected to the conductive tracks (6) and is suited to electronically check the conductive tracks (6) for manipulation. The present invention further relates to a method for producing such a protective arrangement (1).