Randomized Spring Array Electrical Interface for FOD Resistance
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Solution Overview
Problem
Existing securement and release mechanisms for separable components in space and transport systems are vulnerable to foreign object debris (FOD) and fail to maintain secure communication and power links across a broad temperature range, especially during separation and displacement.
Innovation Solution
A randomized spring array, such as a compressible wire mat, is used to create a secure and redundant electrical interface that resists FOD infiltration, maintains electrical continuity across temperature variations, and provides a kickoff force for separation, utilizing a compressible wire mat with multiple windings and turns to ensure multiple points of contact and elastic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical interfaces are used for separable components, then mechanical connection is achieved, but the interface is vulnerable to foreign object debris (FOD) infiltration and fails to maintain secure communication and power links
Solution Approach 1:
The electrical interface is segmented into multiple independent contact points arranged in a randomized pattern, where each contact point can independently establish electrical continuity. This segmentation ensures that FOD infiltration at one contact point does not compromise the entire electrical connection, as other contact points remain functional.
Solution Approach 2:
The electrical interface employs spring-loaded contact points that dynamically adjust their position and pressure based on connection conditions. This dynamic capability allows the contacts to maintain secure electrical continuity despite displacement, vibration, or thermal expansion/contraction, while the randomized arrangement provides redundancy against FOD infiltration.
2Adaptability or versatility
If fixed electrical contacts are used, then structural simplicity is maintained, but the interface fails to accommodate displacement and temperature variations
Solution Approach 1:
The electrical interface utilizes spring-loaded contact points whose mechanical properties (pressure, position) change in response to temperature variations and displacement. The spring mechanism automatically adjusts contact pressure to maintain electrical continuity across a broad temperature range, accommodating thermal expansion and contraction without requiring complex active control systems.
3Reliability
If multiple contact points are implemented for redundancy, then resistance to FOD infiltration improves, but device complexity and weight increase
Solution Approach 1:
The electrical interface employs a flexible printed circuit board (FPC) with integrated spring-loaded contact points. The FPC provides both structural support and electrical connectivity in a lightweight, flexible form factor. The spring mechanism is integrated into the FPC structure rather than being separate components, minimizing additional weight while providing the necessary redundancy and FOD resistance through multiple contact points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a lightweight, resilient electrical interface that maintains communication and power links despite FOD and temperature fluctuations, ensuring continuous operation and facilitating controlled separation with a kickoff force.
Implementation Method 1
the first set of springs (403) and the second set of springs (404) can be compressed as the connector devices (32) and electrical interface elements (22) are brought together
Implementation Method 2
A randomized spring array, such as a compressible wire mat, is used to create a secure and redundant electrical interface that resists FOD infiltration, maintains electrical continuity across temperature variations
Data Source
AI summary
An electrical interface can include one or more connector devices that facilitate communication between components while they are connected. The connector devices can provide a secure communication and/or power link that resists infiltration by foreign object debris (“FOD”) as well as redundant electrical pathways. The connector devices can further provide mechanisms that are lightweight, are operable in a broad range of temperatures (e.g., low temperatures), accommodate displacement without loss of electrical continuity, and are of low resistance and induction. The connector devices can further provide a kickoff force upon separation of the components.


