Electric Range Air Guide Layout for Dual PCB Cooling

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Solution Overview

Problem

Conventional electric ranges have inefficient cooling systems due to straight air guides that heat and discharge cooling air outside, leading to reduced cooling efficiency for both internal and external electronic devices, with insufficient airflow to external components.

Innovation Solution

An electric range design featuring an air discharge hole in the outer wall of the air guide to redirect cooling air to external electronic devices, minimizing the decrease in cooling efficiency for internal components and ensuring sufficient airflow to both internal and external devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the air guide extends straight to guide cooling air, then the cooling air can be directed to electronic devices inside the guide, but the cooling air is heated and discharged outside, reducing cooling efficiency for electronic devices outside the guide

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcooling air flow rate
Core Design Contradiction:
TemperatureVSQuantity of substance

Solution Approach 1:

The air guide is segmented into multiple sections with different functions: a first air guide section for guiding cooling air to internal electronic devices, and a second air guide section with air discharge holes for providing cooling air to external electronic devices. This segmentation allows the system to serve multiple cooling needs simultaneously without compromising the cooling efficiency for either internal or external devices.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different sections of the air guide are designed with different properties: the first section maintains a closed structure for efficient cooling of internal devices, while the second section incorporates air discharge holes to provide cooling air to external devices. This local differentiation optimizes cooling performance for both internal and external electronic devices without compromising overall system efficiency.

Inventive Principle:
Principle #3Local quality

2Quantity of substance

If the lateral lower portion of the air guide is completely open to discharge air outside, then air can be discharged to the outside of the air guide, but flow loss occurs in the lateral direction, reducing the flow rate of air from entrance to exit

Engineering Contradiction:
Improvecooling air dischargeVSAvoidair flow rate
Core Design Contradiction:
Quantity of substanceVSSpeed

Solution Approach 1:

The air guide structure implements local quality by providing air discharge holes only at specific locations (front and rear sides) rather than being completely open along the entire lateral lower portion. This selective discharge approach maintains sufficient cooling air flow rate while still providing adequate cooling to external electronic devices, avoiding the flow loss that would occur with a completely open structure.

Inventive Principle:
Principle #3Local quality

3Quantity of substance

If the gap discharging air is positioned at the lower side of the heat sink, then air can be discharged to external electronic devices, but the flow rate of air flowing to the lower side is smaller than to the upper side, insufficient for cooling external devices

Engineering Contradiction:
Improvecooling air to external devicesVSAvoidair flow rate
Core Design Contradiction:
Quantity of substanceVSSpeed

Solution Approach 1:

The air discharge function is segmented into multiple locations: air discharge holes are provided at both the front side and rear side of the air guide. This segmentation ensures that sufficient cooling air reaches external electronic devices located at different positions, compensating for the lower flow rate at any single discharge location and achieving effective cooling across all external devices.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively suppresses overheating of printed circuit boards by enhancing cooling efficiency for both internal and external electronic devices, preventing damage to control boards and improving assembly efficiency.

Implementation Method 1

a cooling fan that moves cooling air to the heat sink and the electronic devices

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

a heat sink on which a heat-generating electric device (electronic device) among the electric devices is mounted

Methodology Applied
Scientific EffectThermal Conduction: Conduction (thermal)

Implementation Method 3

a flow guide (air guide) disposed on one side of the heat sink

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 4

The induction heating type electric range generates a magnetic field around a coil by applying high frequency power to the coil, and heats an object to be heated made of a metallic material, by using an eddy current generated from the generated magnetic field

Methodology Applied
Scientific EffectElectromagnetic Induction: Electromagnetic Induction

Implementation Method 5

heats an object to be heated made of a metallic material, by using an eddy current generated from the generated magnetic field

Methodology Applied
Scientific EffectEddy Currents: Eddy Currents

Data Source

PatentUS20240263800A1Electric range
Publication Date: 2024.08.08 LG ELECTRONICS INC
  • US20240263800A1 patent drawing
  • US20240263800A1 patent drawing
  • US20240263800A1 patent drawing

AI summary

Disclosed is a microwave oven. The microwave oven disclosed herein has a first electronic component group disposed on the inside of an air guide, and a second electronic component group disposed on the outside of a first side of the air guide, and includes an air discharge hole on an outer wall of the first side of the air guide, such that a portion of air flowing into the air guide to cool the first electronic component group may be provided to the second electronic component group. Accordingly, both the first electronic component group and the second electronic component group can be cooled.