Bonding Sequence Control Using Rank-Based Carrier-Substrate Pairing
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Solution Overview
Problem
Conventional bonding techniques face challenges in achieving a sufficient yield when there is an imbalance in the number of non-defective objects between conveyance units of first and second objects in a bonding apparatus.
Innovation Solution
A bonding method that involves obtaining rank information for first and second objects, deciding a conveyance order based on this information, and conveying carriers and substrates accordingly to optimize the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional bonding technique bonds non-defective objects together and defective objects together, then yield improvement is achieved, but imbalance in the number of non-defective objects between conveyance units causes insufficient yield improvement
Solution Approach 1:
The patent applies preliminary action by obtaining rank information indicating the quality status of objects on carriers and substrates before the bonding process. This advance knowledge allows the system to pre-determine the conveyance order of carriers and substrates to ensure optimal pairing (non-defective with non-defective, defective with defective), thereby resolving the yield improvement insufficiency caused by conventional techniques that do not account for object quality distribution imbalances.
2Productivity
If conveyance order is optimized based on rank information, then yield of bonded objects is improved, but system complexity increases due to additional information processing
Solution Approach 1:
The patent implements feedback by obtaining rank information that reflects the actual quality status of objects on carriers and substrates. This feedback mechanism provides real-time data about object quality distribution, enabling the control system to adjust the conveyance order dynamically. The feedback loop ensures that the bonding process adapts to the actual state of objects, achieving yield improvement through data-driven decision making while managing system complexity through structured information flow.
Data Source
AI summary
A bonding method of conveying a plurality of carriers and a plurality of substrates and boding a first object and a second object, the plurality of carriers each holding a plurality of first objects, the plurality of substrates each having a plurality of second objects formed thereon, the method including obtaining rank information including data indicating ranks of the respective first objects for each of the plurality of carriers and data indicating ranks of the respective second objects for each of the plurality of substrates, deciding, based on the rank information, a conveyance order of the plurality of carriers and a conveyance order of the plurality of substrates, and conveying the plurality of carriers and the plurality of substrates to the bonding apparatus in accordance with the conveyance orders decided in the deciding, and bonding the first object and the second object.