Rapid Heat Dissipation Device Using Overlapping Siphon and Heat Pipe Fields
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Solution Overview
Problem
Existing heat dissipation devices often fail to uniformly dissipate heat due to heat accumulation in the heat source or at specific parts of the device during the heat transfer process, leading to inefficient cooling.
Innovation Solution
A rapid heat dissipation device is designed with a heat conducting plate, heat dissipating fin group, heat pipes, and a siphon heat-dissipating device, where the heating field of the siphon device overlaps with that of the heat pipe in the same direction, ensuring uniform heat distribution and dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat pipe is used for heat dissipation, then heat transfer efficiency is improved, but heat may accumulate in the heat source or at specific parts of the device
Solution Approach 1:
The patent combines a heat pipe and a siphon heat-dissipating device into a single integrated system. The heat pipe provides efficient heat transfer from the heat source, while the siphon device overlaps its heating flowing field with that of the heat pipe in the same direction, ensuring uniform heat distribution and preventing heat accumulation at specific parts.
Solution Approach 2:
The siphon heat-dissipating device is stacked above the heat pipe, creating a vertical layered structure. This three-dimensional arrangement allows the heating flowing fields of both devices to overlap in the vertical dimension, enhancing uniform heat dissipation across the heat source surface.
2Loss of energy
If additional devices like fans or water cooling are added to improve heat dissipation performance, then cooling capability is enhanced, but device complexity increases
Solution Approach 1:
The patent merges the functions of heat pipe and siphon heat-dissipating devices into a single integrated assembly that works synergistically. This combination achieves enhanced cooling performance without requiring additional external devices like fans or water cooling systems, thereby avoiding increased structural complexity.
3Productivity
If heat dissipation device is not uniformly heated, then heat dissipation efficiency decreases, but adding more heat dissipation components increases device complexity
Solution Approach 1:
The patent introduces a vertical stacking arrangement where the siphon heat-dissipating device is positioned above the heat pipe. This creates overlapping heating flowing fields in the vertical dimension, achieving uniform heat distribution across the heat source without requiring multiple components in the horizontal plane, thus maintaining simplicity while improving efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents heat accumulation, allowing for uniform heat dissipation and cooling, enhancing the overall performance of the device by ensuring consistent heat transfer across the heat source and dissipation fin group.
Implementation Method 1
at least one heat pipe, one end thereof fixed to the heat conducting plate and another end thereof fixed to the heat dissipating fin group
Implementation Method 2
Heat is transferred to the fins or the heat radiator through the heat conducting plate
Implementation Method 3
a siphon heat-dissipating device, stacked above the at least one heat pipe and one end thereof fixed to the heat conducting plate and another end thereof fixed to the heat dissipation fin group
Implementation Method 4
a siphon heat-dissipating device having a coolant or a working fluid being provided therein
Implementation Method 5
a plurality of fins are disposed on the heat conducting plate to form a heat radiator
Implementation Method 6
Heat is transferred to the fins or the heat radiator through the heat conducting plate to provide a heat dissipating function
Data Source
AI summary
A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.