Rapid Prototyping High Density Circuit Integration
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Solution Overview
Problem
Current rapid prototyping technologies face limitations in integrating fluid media, such as direct-write inks, for manufacturing complex electromechanical parts, particularly in achieving high density circuits and reducing size, mass, and manufacturing cycle times, and are incompatible with high temperatures required for annealing these inks.
Innovation Solution
Combining stereolithography (SL) with direct-write (DW) technologies to enable automated deposition and curing of fluid media within RP systems, allowing for the integration of complex 3D embedded circuitry and the creation of compact, reliable electromechanical systems, including solderless connectors and pilot devices with reduced contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If direct-write inks are deposited for high density circuits, then circuit density and integration are improved, but temperature compatibility deteriorates due to SL resin incompatibility with annealing temperatures
Solution Approach 1:
The system separates the deposition and curing processes into distinct stages, allowing DW ink to be deposited first and then cured using alternative methods (UV curing, room temperature curing, or post-processing annealing after SL building), thus avoiding direct exposure to high temperatures during the SL building process
Solution Approach 2:
The patent introduces intermediary curing methods (UV curing lamps, photoinitiators) that enable curing of DW ink at lower temperatures compatible with SL resin, serving as a mediator between the high-temperature annealing requirement and the low-temperature SL process
2Productivity
If automated deposition of fluid media is integrated during RP processing, then manufacturing efficiency and automation are improved, but process complexity increases due to integration of multiple technologies
Solution Approach 1:
The system merges DW deposition capabilities directly into the SL RP machine by integrating a DW inkjet print head with the SL laser system, allowing both processes to occur within a single machine environment without requiring separate equipment
Solution Approach 2:
The integrated system provides multi-functionality by enabling the SL machine to perform both structural part building and circuit trace deposition, allowing a single device to execute multiple manufacturing operations that would traditionally require separate machines
3Loss of time
If continuous building without interruption is maintained, then manufacturing cycle time is reduced, but ability to encapsulate electromechanical components is lost
Solution Approach 1:
The system performs preliminary actions by depositing DW ink traces and curing them during early layers before final encapsulation, allowing circuit paths to be established in advance while maintaining the ability to pause and encapsulate components later in the building process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration facilitates rapid prototyping of high-density circuits, enabling weight savings, self-assembly, and reduced manufacturing times, while eliminating manual connections and supporting continuous conductive paths, suitable for aerospace and other sensitive applications.
Implementation Method 1
SL machines typically focus an ultraviolet (UV) laser onto a cross-section of a liquid photopolymer resin. The laser, in turn, selectively cures a resin to form a structure, layer by layer.
Implementation Method 2
Others have demonstrated systems for automatic dispensing of conductive, thermally curable media, such as direct-write (DW) inks, for maskless patterning of electronics.
Implementation Method 3
many SL resins have been found to be incompatible with, for example, the high temperatures required to anneal DW inks.
Data Source
AI summary
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.